Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YLPTEC MGJ2D241802SC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YLPTEC MGJ2D241802SC
- Type
- YLPTEC
- Minimum package
- 25 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YLPTEC
- Electronic Component
- MGJ2D241802SC
- Electronic Component
- 1
- Electronic Component
- 9.8mm
- Package
- SIP-5
- Type
- Electronic Component
- Electronic Component
- Isolated Power Supply Module
- Electronic Component
- 5.25g
- Electronic Component
- 19.5mm
- Electronic Component
- 12.5mm
- Electronic Component
- 1
- Electronic Component
- BM0264771653
- Operating Temperature
- 40℃~+105℃
- Switching Frequency
- 100Hz
- Electronic Component
- 200mVp-p
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MGJ2D241802SC 产品概述
一、产品简介
MGJ2D241802SC 是 YLPTEC(易川) 推出的塑封 SIP-5 DC-DC 模块，专为 IGBT 驱动器设计。模块采用非对称双输出（18V / -2.5V），旨在减少 IGBT 驱动损耗并提高系统可靠性。封装紧凑，适合集成到变频器、交流伺服、电焊机和 UPS 等电力电子设备中。
二、主要电气参数
- 输入电压：23.3V ～ 24.7V
- 输出电压：+18V 与 -2.5V（双路）
- 输出电流（单路最大）：80mA
- 转换效率：约 90%
- 隔离耐压：3kV(rms)
- 开关频率：100Hz
- 静态电流：20mA
- 输出纹波噪声：200mVp-p
- 最大容性负载：220µF
三、功能与保护
模块具备输出短路保护与自动故障恢复功能，能够在短路或过载解除后自动恢复输出，降低系统维护负担。此外非对称输出设计可降低驱动器开关过程中的能耗与应力，提高可靠性。
四、机械与环境特性
- 封装形式：塑封 SIP-5
- 外形尺寸：19.5mm × 9.8mm × 12.5mm（长×宽×高）
- 工作温度范围：-40℃ ～ +105℃
五、应用建议与注意事项
- 建议在输入端与输出端布置低 ESR 去耦电容，以抑制纹波并提升瞬态响应；输出电容不宜超过说明的 220µF。
- 接地与信号地应合理分离，保持隔离策略完整，避免干扰回路影响驱动精度。
- 在高温或满载工况下应做适当降额设计，保证模块长期可靠运行。
- 由于模块为隔离型输出，进行系统级安全设计时请参照 3kV 隔离等级规范。
六、典型应用场景
适用于通用变频器、交流伺服驱动系统、电焊机以及不间断电源(UPS)中作为 IGBT 驱动电源或辅助电源，尤其适合要求体积小、效率高、具短路自恢复能力的场合。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
