WMSIC Electronic Components

YLPTEC QA123C-1502R3 QA123C

ModelQA123C-1502R3
PackageSIP-5
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC QA123C-1502R3
Type
YLPTEC
Minimum package
25 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
QA123C-1502R3
Electronic Component
1
Electronic Component
9.8mm
Package
SIP-5
Electronic Component
Isolated Power Supply Module
Electronic Component
5.12g
Electronic Component
19.5mm
Electronic Component
12.5mm
Electronic Component
1
Electronic Component
BM0264771673
Operating Temperature
40℃~+105℃
Switching Frequency
200kHz
Electronic Component
100mVp-p
Conversion
87%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

QA123C-1502R3 产品概述

QA123C-1502R3 是 YLPTEC(易川) 为 SiC MOSFET 驱动器专门设计的双路隔离式 DC‑DC 模块。模块采用非对称电压输出(-2.5V / +15V),在 12V 工作母线环境下可显著降低 SiC 器件的开关损耗与应力,同时提供高绝缘强度与自恢复保护机制,适合高可靠性电力电子系统使用。

一、主要参数速览

  • 输入电压:Vin = 10.8V ~ 13.2V(典型 12V 母线兼容)
  • 输出通道:2 路(Vout = -2.5V,+15V)
  • 最大输出电流:100 mA(每路)
  • 最大容性负载:2200 μF
  • 转换效率:Typ. 87%
  • 隔离电压:5.0 kVrms(加强绝缘等级)
  • 局部放电电压:1700 V
  • 开关频率:200 kHz
  • 纹波噪声:100 mVp-p
  • 静态电流:8 mA
  • 工作温度:-40 ℃ ~ +105 ℃
  • 保护功能:输出短路保护且自动故障恢复
  • 封装:SIP-5(尺寸:19.5 × 9.8 × 12.5 mm)

二、设计亮点与优势

  • 非对称双输出(-2.5V / +15V):为 SiC MOSFET 驱动器提供所需的负向关断电压与较高的正向驱动电压,有利于减少开关损耗并改善关断抗干扰能力。
  • 高隔离与局部放电控制:5 kVrms 隔离与 1700 V 的局部放电性能,满足加强绝缘要求,适用于高电压、高安全等级的电力电子系统。
  • 高效率与高频开关:87% 的典型效率和 200 kHz 的开关频率,使模块体积小、热量可控,便于在有限空间内实现高功率密度设计。
  • 可靠的保护机制:输出短路保护且具自恢复能力,避免系统因瞬态短路而长期失效,提升整机可靠性。
  • 宽温度范围:-40℃ ~ +105℃ 的工作温度覆盖严苛环境,适用于工业级与车载类应用。

三、典型应用

  • SiC MOSFET 驱动器电源
  • 通用变频器与电机驱动(交流伺服)
  • 电焊机驱动与功率控制模块
  • 不间断电源(UPS)和工业逆变器
  • 其他需要隔离、负输出与高可信赖性的电力电子系统

四、在系统设计中的注意事项

  • 输入去耦:在模块输入端靠近模块布置低 ESR 电容(如陶瓷)以抑制瞬态和降低输入纹波;同时可并联电解或钽电容以增强低频能量储备。
  • 输出滤波与容性负载:模块支持最多 2200 μF 的容性负载,但建议使用低等效串联电阻(ESR)且符合厂商推荐值的电容;过大容性负载会影响瞬态响应与启动行为,应在系统层面验证启动顺序。
  • 散热与布局:尽管效率高,但在满载与高温时仍产生热量,设计时应保证良好自然对流或必要的强制冷却;模块邻近热敏器件应留足间距。
  • 地线与屏蔽:输入母线与模块地应低阻连接,信号地与功率地分割并适当汇流,减少开关噪声对驱动信号的影响。
  • 隔离安全:模块具有高压隔离能力,但在 PCB 设计时仍需遵守爬电距离与固体绝缘要求,并根据系统要求布置测试与接地策略。
  • 启动与故障处理:模块具自恢复短路保护,但建议在上电与异常情况下监测输出电压并实现必要的故障上报或旁路策略。

五、封装与安装

  • 封装类型:SIP-5,适合直插安装(请按实际 PCB 孔位与机械尺寸设计焊盘与固定结构)。
  • 尺寸参考:19.5 mm × 9.8 mm × 12.5 mm(长×宽×高),便于在狭小空间内实现模块化电源布置。
  • 焊接与清洗:如通过波峰/手工焊接安装,注意温度曲线和清洗剂对模块封装的兼容性;建议遵循制造商的焊接工艺指南。

六、可靠性与选型建议

  • 若目标系统以 12V 母线为主并需为 SiC 驱动提供正负驱动电压,QA123C-1502R3 是直接匹配的解决方案,兼顾效率、尺寸与绝缘安全性。
  • 在需要更高驱动电流或更严格瞬态性能的场合,应评估并联供电或外置驱动缓冲级;对于特殊环境(如高振动、高湿度)应与供应商确认额外的可靠性数据与测试结果。
  • 订购信息:品牌 YLPTEC(易川),型号 QA123C-1502R3。请在样机验证阶段重点评估启动行为、纹波与高温额定输出能力。

如需详细引脚定义、典型电路、热特性曲线或应用参考设计图,请提供您的使用场景与 PCB 约束,我可以基于这些条件给出更具体的布局与选型建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.