WMSIC Electronic Components

TXM25M0004322JBDDO00T

ModelTXM25M0004322JBDDO00T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TXM25M0004322JBDDO00T
Type
YJX
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TXM25M0004322JBDDO00T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.05g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0263481350
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
16pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TXM25M0004322JBDDO00T贴片晶振产品概述

TXM25M0004322JBDDO00T是雅晶鑫(YJX)推出的一款通用型25MHz贴片石英晶振,采用SMD3225-4P封装,兼顾高精度、宽温稳定性与易贴装性,广泛适配消费电子、通信、工业控制及车载电子等领域的时钟同步与振荡电路需求。

一、产品核心定位与典型应用场景

该晶振属于工业级通用频率晶振,核心定位是为中高精度时钟系统提供稳定的基准振荡源,平衡了性能与成本,适配多场景需求。典型应用包括:

  1. 消费电子:智能手机基带芯片时钟、平板电脑WiFi/蓝牙模块同步时钟、智能穿戴设备的定时电路;
  2. 通信设备:路由器、交换机、光模块的参考时钟(保障数据传输同步性)、基站射频单元的本振源;
  3. 工业控制:PLC可编程逻辑控制器的定时模块、工业传感器的信号采样时钟、伺服电机驱动的同步电路;
  4. 车载电子:车载导航仪的GPS同步时钟、仪表盘的显示刷新时钟、CAN总线控制器的通信基准(适配-40℃~+85℃车载温宽)。

二、关键参数详解与性能优势

各核心参数直接决定了产品的适用场景,其实际意义与优势如下:

  1. 频率与精度:标称频率25MHz(通用标准频率,适配多数芯片的时钟输入),常温频差±10ppm——25℃下频率偏差不超过250Hz,满足WiFi模块(20ppm以内要求)、PLC定时(10ppm精度需求)等场景;
  2. 负载电容:16pF(振荡电路匹配核心参数)——需与电路负载电容(含PCB寄生电容,通常2~3pF)总和匹配为16pF,可避免频率偏移或振荡不稳定;
  3. 频率稳定度:±20ppm(-40℃~+85℃全温区)——温宽内频率变化≤500Hz,相比商业级晶振(±50ppm)更适合高低温交替的工业/车载环境;
  4. 等效串联电阻(ESR):35Ω(低串联电阻)——ESR越低,振荡电路起振越容易,功耗更低、噪声更小,减少电路调试难度;
  5. 工作温度范围:-40℃~+85℃(工业级温宽)——覆盖户外设备、车载及工业现场的温度需求,无需额外散热/保温设计。

三、封装与可靠性设计

采用SMD3225-4P封装(3.2mm×2.5mm×0.8mm),具备以下设计优势:

  1. 贴片式适配:适配自动化SMT贴装生产线,贴装效率高,适合大规模量产;4引脚双端输入输出,布局简洁,减少PCB布线复杂度;
  2. 抗环境干扰:封装结构紧凑,抗振动(符合IEC 60068-2-6振动测试标准)、抗冲击,适合移动设备或工业现场的机械应力环境;
  3. 耐温可靠性:采用石英晶体谐振器核心,搭配耐高温封装材料,无铅回流焊可承受≤260℃峰值温度(时间≤10s),避免热损伤。

四、品牌与品质保障

雅晶鑫(YJX)作为国内专注晶振研发的厂商,该产品品质管控具备以下优势:

  1. 全流程测试:出厂前经过高低温循环测试(-40℃~+85℃)、频率精度校准、ESR测试及振动冲击测试,保障每颗晶振一致性;
  2. 环保合规:符合RoHS 2.0及REACH标准,无铅无卤,适配全球市场环保要求;
  3. 技术支持:提供datasheet、应用电路参考及调试咨询,帮助客户快速落地设计。

五、应用注意事项

为保障性能稳定,应用时需注意:

  1. 负载电容匹配:电路需预留16pF负载电容(含寄生电容),建议选用±5%精度陶瓷电容;
  2. 焊接规范:无铅回流焊峰值温度≤260℃(时间≤10s),手工焊接烙铁温度≤350℃(时间≤3s);
  3. 机械应力控制:PCB设计避免晶振附近过孔/弯折,贴片后不按压晶振,防止晶体碎裂;
  4. 噪声隔离:振荡电路远离开关电源等噪声源,电源端加10μF电解+0.1μF陶瓷电容滤波。

该晶振凭借稳定性能、宽温适配性与通用频率,成为中低端到中端电子设备时钟系统的高性价比选择,可有效降低设计成本并保障可靠性。

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