WMSIC Electronic Components

F32258MUBCE2O

ModelF32258MUBCE2O
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX F32258MUBCE2O
Type
YJX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
F32258MUBCE2O
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.051g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264778345
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.3V
Operating Current
5mA
Electronic Component
±10ppm
Output
CMOS
Frequency
±10ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

F32258MUBCE2O 晶体振荡器产品概述

一、核心性能参数总览

F32258MUBCE2O是一款8MHz基准频率的石英晶体振荡器,核心参数覆盖通用型时钟源的关键需求,具体如下:

  • 基准频率:8MHz(主流通用频率,适配多数MCU、FPGA、通信芯片的时钟输入接口,无需额外倍频/分频);
  • 常温频差:±10ppm(25℃环境下输出频率与标称值的偏差,满足工业级基本精度要求,避免时钟漂移影响时序同步);
  • 输出模式:CMOS(数字电平输出,高电平接近VCC、低电平接近GND,驱动能力强,可直接匹配TTL/CMOS逻辑,无需缓冲器);
  • 工作电压:1.8V~3.3V(覆盖低功耗嵌入式系统<如1.8V IoT节点>和常规3.3V应用,简化电源设计);
  • 工作电流:5mA(平衡性能与功耗,既保证输出信号质量,又适配电池供电的便携设备);
  • 频率稳定度:±10ppm(温度、电压变化下的最大频率偏移,宽温环境下仍能维持时钟精度);
  • 工作温度:-40℃~+85℃(工业级宽温,适应户外、车间等极端温度场景)。

二、封装与物理特性

采用SMD3225-4P表面贴装封装,是小型化时钟源的典型选择:

  • 尺寸规格:3.2mm×2.5mm×0.8mm(L×W×H),比传统DIP封装缩小60%以上,适配高密度PCB布局(如智能手环、IoT模块);
  • 引脚配置:4引脚(常规为VCC、GND、OUT、NC,部分批次可能优化为低噪声引脚布局);
  • 焊接兼容性:支持回流焊、波峰焊工艺,适合自动化贴片生产;无铅封装符合RoHS指令,环保安全。

三、电气性能关键优势

  1. 宽电压适配性:1.8V~3.3V覆盖范围可直接匹配不同电源设计的系统,无需额外DC-DC转换电路,降低BOM成本;
  2. CMOS输出可靠性:输出电平稳定,驱动能力可达10pF负载,可同时驱动2~3个数字芯片,避免信号衰减导致的时序错误;
  3. 宽温频率稳定:-40℃+85℃范围内频率偏移≤±10ppm,例如在-20℃环境下,实际输出频率为7.99992MHz8.00008MHz,满足工业控制、户外通信的时序要求;
  4. 功耗与性能平衡:5mA工作电流在同类型8MHz晶振中处于中等水平,比温补晶振(TCXO)功耗低30%以上,适合电池供电的便携医疗设备、智能穿戴。

四、典型应用场景

F32258MUBCE2O的参数特性使其适配多领域需求:

  • 工业控制:PLC可编程控制器、传感器节点、电机驱动器(宽温适应车间-40~85℃环境,稳定度保证控制时序精度);
  • 消费电子:智能音箱、路由器、智能家居中控(小型化封装适配紧凑PCB,宽电压兼容不同电源设计);
  • 物联网(IoT):低功耗传感器节点、网关设备(1.8V适配低功耗MCU,稳定度保证数据传输同步);
  • 医疗电子:便携式监护仪、血糖监测仪(宽温适应不同使用场景,稳定度保证采样数据准确性)。

五、品牌与可靠性说明

  • 品牌背景:YJX(雅晶鑫)是国内专注晶体振荡器研发的厂商,产品覆盖石英晶振、温补晶振等,服务于工业、消费电子领域超10年;
  • 可靠性保障:产品通过温度循环(-40℃+85℃循环50次)、振动测试(102000Hz,1g加速度)、老化测试(25℃下48小时),符合工业级产品标准;
  • 供货支持:拥有稳定生产供应链,可满足批量订单需求;部分型号支持参数定制(如频率微调、输出负载调整)。

综上,F32258MUBCE2O凭借宽温、宽电压、稳定性能,成为工业控制、消费电子、IoT等领域的高性价比时钟源选择,适配紧凑设计与恶劣环境需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.