WMSIC Electronic Components

SX201232768K2GHCZ2T

ModelSX201232768K2GHCZ2T
PackageSMD2012-2P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX SX201232768K2GHCZ2T
Type
YJX
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
SX201232768K2GHCZ2T
Electronic Component
1
Package
SMD2012-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.04g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264778337
Operating Temperature
40℃~+85℃
Electronic Component
±18ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12.5pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SX201232768K2GHCZ2T — 32.768kHz SMD贴片晶振产品概述

一、产品简介

SX201232768K2GHCZ2T 是 YJX(雅晶鑫)出品的一款低频贴片晶振,标准振荡频率 32.768kHz,适用于实时时钟(RTC)与低功耗计时应用。器件为 SMD2012-2P 小型封装,尺寸约 2.0 × 1.2 mm,面向对体积、功耗与长期稳定性有要求的便携与嵌入式电子系统。

主要规格汇总:

  • 晶振类型:贴片晶振(SMD)
  • 频率:32.768 kHz
  • 常温频差:±18 ppm(室温)
  • 频率稳定度:±30 ppm(全温区)
  • 负载电容:12.5 pF
  • 等效串联电阻(ESR):70 kΩ
  • 工作温度:-40 ℃ 至 +85 ℃
  • 封装:SMD2012-2P
  • 品牌:YJX(雅晶鑫)

二、主要特性与优势

  1. 超低功耗:32.768kHz 的低频设计适合 RTC 与低频睡眠计时,配合低功耗 MCU 能显著降低系统待机能耗。
  2. 小尺寸封装:SMD2012-2P 体积小,利于空间受限的便携设备与模块化设计。
  3. 良好频率稳定性:常温±18ppm 与全温区±30ppm 能满足大多数消费类与工业级计时精度需求。
  4. 高 ESR 典型值(70kΩ):为常见调频叉晶特征,需注意驱动电路的振荡启动能力匹配。

三、典型应用场景

  • 实时时钟(RTC)与日期/时间记录
  • 低功耗传感器节点、物联网终端
  • 消费电子(手表、遥控、显示模块)
  • 医疗监护等需长期稳定计时的设备

四、电路与布局建议

  1. 常用的驱动方式为 MCU 内置的 Pierce 振荡器。选择 MCU 时,请确认其振荡器能驱动 ESR ≈ 70kΩ 的晶体。
  2. 负载电容匹配:基于 CL = 12.5 pF,且考虑封装与 PCB 引脚的寄生电容(典型 2–5 pF),推荐两端电容 C1、C2 取值约 18–22 pF(等值)。计算关系:CL ≈ (C1·C2)/(C1+C2) + Cstray。
  3. 将晶振尽量靠近 MCU 芯片摆放,缩短引脚到振荡器引脚的走线长度,避免走线下方有高速信号或电源噪声,保证接地良好。
  4. 在振荡回路附近布置去耦电容与稳压,避免开关噪声耦入振荡器。
  5. 若振荡启动困难,可适当调整 MCU 的驱动强度或检查 PCB 寄生电容;不建议随意并联电阻或增大驱动电流,以免影响长期可靠性。

五、可靠性与焊接、保存建议

  • 焊接:建议按供应商或行业标准的回流焊工艺进行,遵循推荐的温度曲线与峰值温度。若有严格回流要求,请参照 YJX 提供的详细焊接规范。
  • 保存与搬运:器件应避免潮湿、强震动与强静电环境,建议在干燥箱中保存并遵守防静电操作。
  • 工作环境:工作温度 -40~+85 ℃,请确保系统在此温度范围内使用以保证规格性能。

六、选型与替代考量

在选型时应确认 MCU 振荡器能支持高 ESR 晶体的启动;若系统对稳定性或温漂有更高要求,可考虑温度补偿或更高等级稳定度的器件。与其他 32.768kHz 方案比较时,注意负载电容、ESR 与封装尺寸对电路匹配与布局的影响。

七、结语

SX201232768K2GHCZ2T(YJX 雅晶鑫)以小尺寸、低功耗与良好温漂特性为设计目标,适合嵌入式 RTC 与各种需精准低频时基的应用。为获得最佳性能,请按上述负载电容匹配与布局规范设计振荡回路,并参考供应商提供的详细数据手册与焊接指南。若需更高稳定度或定制测试数据,可联系供应商获取进一步技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.