WMSIC Electronic Components

G32258192MUBCK2O

ModelG32258192MUBCK2O
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX G32258192MUBCK2O
Type
YJX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
G32258192MUBCK2O
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.046g
Frequency
8.192MHz
Electronic Component
1
Electronic Component
BM0264981817
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.3V
Operating Current
5mA
Electronic Component
±10ppm
Output
CMOS
Frequency
±10ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

G32258192MUBCK2O 晶体振荡器产品概述

G32258192MUBCK2O是雅晶鑫(YJX)推出的一款工业级贴片晶体振荡器,采用SMD3225-4P封装,以8.192MHz为核心振荡频率,具备宽温适应性、稳定电气性能及小型化设计,可满足工业控制、消费电子、物联网等多领域的时钟同步需求。

一、产品基本定位

该晶振针对高可靠性、小型化、宽温应用场景设计,兼顾性能与成本优势:

  • 工业级温度范围覆盖-40℃至+85℃,可适应户外、车间等极端环境;
  • 小型SMD3225封装(3.2mm×2.5mm)适配便携式设备、高密度PCB布局;
  • CMOS输出兼容主流数字电路(MCU、FPGA、通信芯片等),无需额外电平转换。

二、核心性能参数解析

1. 频率与稳定特性

  • 主振频率:8.192MHz(2^13 Hz,常见于二进制分频场景,便于数字电路时钟管理);
  • 常温频差:±10ppm(即频率偏差≤81.92Hz,满足大多数数字系统对时钟精度的要求);
  • 频率稳定度:±10ppm(覆盖工作温度范围及电源波动时,频率变化控制在81.92Hz内,保证系统时钟同步可靠性)。

2. 电气性能

  • 工作电压:1.8V~3.3V(兼容低功耗MCU(如1.8V供电)及主流3.3V系统,适配电池供电/市电供电场景);
  • 工作电流:5mA(典型值,兼顾输出驱动能力与功耗平衡,适合低功耗设备);
  • 输出模式:CMOS(逻辑电平与供电电压匹配,输出驱动能力强,可直接驱动多负载)。

3. 环境适应性

  • 工作温度:-40℃~+85℃(工业级宽温,可替代部分军品级应用中的常规温区晶振);
  • 存储温度:-55℃~+125℃(满足运输及长期存储的温度要求)。

三、封装与引脚说明

采用SMD3225-4P贴片封装,尺寸为3.2mm(长)×2.5mm(宽)×0.8mm(典型厚度),4引脚布局符合行业标准:

  • 引脚1:电源正极(VDD);
  • 引脚2:电源地(GND);
  • 引脚3:时钟输出(OUT);
  • 引脚4:NC(空脚,部分批次可能为使能脚,需参考 datasheet 确认)。

封装特点:无引线设计,焊接可靠性高;小型化适配高密度PCB,降低设备体积与重量。

四、典型应用场景

该晶振的参数特性使其可广泛应用于以下领域:

  1. 工业控制:PLC模块、传感器节点、电机控制器(宽温适应车间/户外环境);
  2. 消费电子:智能手表、蓝牙耳机、智能家居网关(小型封装+低电压适配便携设备);
  3. 通信设备:蓝牙模块、WiFi模块、LoRa网关(稳定度保证数据传输同步);
  4. 物联网终端:环境监测节点、智能电表(低功耗+宽温满足户外长期部署)。

五、使用注意事项

  1. 焊接工艺:回流焊峰值温度≤260℃(持续≤10s),手工焊接烙铁温度≤350℃(焊接≤3s),避免过温损坏;
  2. 电源滤波:VDD引脚串联100nF陶瓷电容到GND,滤除电源噪声,保证频率稳定;
  3. PCB布局:输出引脚远离高频信号线(如射频线),晶振下方尽量不布铜箔,减少寄生电容;
  4. 存储要求:未焊接晶振存放在常温(15℃~35℃)、干燥(相对湿度≤60%)环境,避免潮湿/腐蚀性气体。

六、品牌与可靠性

雅晶鑫(YJX)作为国内晶体振荡器主流厂商,具备完善的生产测试体系:

  • 出厂前经全温区频率测试、老化筛选,保证一致性;
  • 符合RoHS环保标准,适配全球市场需求。

G32258192MUBCK2O通过平衡性能、尺寸与成本,成为工业及消费电子领域时钟同步的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.