Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TX322540M4HBDD2T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YJX TX322540M4HBDD2T
- Type
- YJX
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YJX
- Electronic Component
- TX322540M4HBDD2T
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.05g
- Frequency
- 40MHz
- Electronic Component
- 1
- Electronic Component
- BM0264778317
- Operating Temperature
- 30℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 15pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TX322540M4HBDD2T 贴片晶振产品概述
一、产品基本定位与核心标识
这款TX322540M4HBDD2T是雅晶鑫（YJX）推出的3225封装通用贴片晶振，型号中“TX3225”对应SMD3225-4P封装（3.2×2.5mm尺寸，4脚表面贴装），“40M”明确基准频率为40MHz，后缀则对应其负载电容、频差等关键参数。作为中高精度晶振，它主打“小体积+宽温稳定”，适配多场景电子设备的时钟同步需求。
二、核心性能参数详解
频率与精度
基准频率稳定在40MHz，常温（25℃左右）频差控制在±10ppm内——即每1MHz的偏差不超过0.01kHz，能满足通信、计时类设备的同步要求；全温范围（-30℃~+85℃）的频率稳定度为±20ppm，极端温度下仍能保持输出稳定，避免设备因温度波动出现性能异常。负载电容与ESR
推荐负载电容为15pF（需与外围电容组合实现等效负载），是振荡电路设计的关键匹配参数；等效串联电阻（ESR）为30Ω，属于中低水平——低ESR可减少信号损耗，让输出波形更干净，同时降低电路功耗。工作温度范围
覆盖-30℃至+85℃，比普通消费级晶振（0~70℃）更宽，可适应户外设备、工业现场等复杂环境，无需额外温度补偿电路即可稳定工作。
三、封装与生产工艺
该晶振采用SMD3225-4P贴片封装，尺寸仅3.2mm×2.5mm×1.0mm（典型厚度），4脚设计适配自动化SMT工艺，适合批量生产。雅晶鑫采用“真空封装+陶瓷外壳”工艺，有效隔离湿气、灰尘对晶振片的影响，提升长期可靠性。
四、典型应用场景
- 消费电子：智能手表、蓝牙耳机、便携式游戏机等小型化设备——小封装节省PCB空间，40MHz频率适配蓝牙、WiFi模块的时钟需求；
- 工业控制：PLC、传感器节点、工业网关——宽温范围满足车间冬夏温度变化（-30℃~+85℃）；
- 通信设备：无线路由器、4G/5G小基站、物联网网关——±10ppm频差保障数据传输同步，避免丢包延迟；
- 车载辅助设备：行车记录仪、胎压监测模块——低温适配北方冬季，高温耐受车内暴晒环境（参数覆盖车载常用温区）。
五、选型与使用注意事项
- 负载电容匹配：外围电容需组合成15pF等效负载，若不匹配会导致频率偏移（每差1pF可能引起数ppm偏差）；
- 焊接工艺：回流焊需遵循雅晶鑫曲线（峰值240±5℃，超245℃时间≤10s），避免热应力导致晶振片开裂；
- 静电防护：晶振为静电敏感元件（HBM 2000V），生产中需佩戴防静电手环，避免直接触摸引脚。
六、总结
TX322540M4HBDD2T以“小体积、宽温稳定、低ESR”为核心优势，平衡了性能与成本，覆盖消费电子、工业、通信等多领域。适合对空间、温度适应性有要求但无需超高精度的电子设备选型，是雅晶鑫通用型晶振中的代表性产品。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
