WMSIC Electronic Components

TAXM24M4ZCBCDT2T

ModelTAXM24M4ZCBCDT2T
PackageSMD2016-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TAXM24M4ZCBCDT2T
Type
YJX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TAXM24M4ZCBCDT2T
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.031g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0264778292
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
9pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAXM24M4ZCBCDT2T 产品概述

一、产品简介

TAXM24M4ZCBCDT2T 是雅晶鑫(YJX)推出的一款全国产贴片晶振,标称频率 24.000 MHz。器件采用超小超薄 SMD2016-4P 封装,面向要求体积小、频率精度高的便携式和嵌入式系统。凭借稳定的频率性能与良好的工艺一致性,适合对时钟精度和空间受限有较高要求的应用场景。

二、主要技术参数

  • 晶振类型:贴片晶振(SMD)
  • 频率:24.000 MHz
  • 常温频差:±20 ppm
  • 频率稳定度(总体):±20 ppm
  • 负载电容:9 pF
  • 等效串联电阻(ESR):30 Ω(典型/上限规格)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD2016-4P
  • 品牌:YJX(雅晶鑫)

三、产品特点

  • 小尺寸、超薄设计,便于在空间受限的 PCB 上布局,适配 BGA、QFN 等紧凑型器件周边。
  • 高精度:常温频差及频率稳定度控制在 ±20 ppm,满足大多数通信、计时和控制应用对频率精度的要求。
  • 可靠性:工作温度覆盖工业级范围(-40℃ 至 +85℃),适用于室温及工业环境。
  • 良好驱动能力:9 pF 负载电容匹配常见 MCU/USART 晶振电路,30 Ω 的 ESR 在小功耗设计下提供稳定振荡开始条件。

四、典型应用

  • 微控制器(MCU)时钟源与系统定时器
  • 无线模块与射频前端参考频率(非关键 RF 链路)
  • 工业控制、消费电子、物联网终端、可穿戴设备等对体积和精度有要求的场合
  • 各类通信接口与计测仪表的参考时钟

五、封装与焊接注意事项

  • 建议将晶振放置在被驱动器件(如 MCU)引脚的附近,缩短引线长度以减少寄生电感和干扰。
  • 负载电容按规范选型并尽量靠近晶振和 MCU 引脚布置,保证对称布局以维持频率精度。
  • 推荐采用标准回流焊工艺,遵循晶振厂商的回流温度曲线和焊接工艺规范以避免机械应力和热损伤。
  • 焊盘设计应参考 SMD2016-4P 的制造资料,使用稳定的地平面并避免穿越高频信号线以降低 EMI 影响。

六、选型与采购建议

  • 若系统对频率精度或温漂有更高要求,可咨询厂商是否有更高稳定度或温度补偿型号。
  • 在选型时注意 MCU 的负载电容匹配(9 pF)与起振条件(ESR 最大值),必要时在样机阶段评估起振裕度与相位噪声特性。
  • 雅晶鑫(YJX)提供的全国产化供应链利于长期供货与质量追溯,量产前建议索取样品并进行可靠性测试与环境应力验证。

如需更详细的电气等效图、频率与温度曲线、机械尺寸或回流焊工艺参数,可联系供应商获取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.