WMSIC Electronic Components

TAXM25M2QLFCDT1T

ModelTAXM25M2QLFCDT1T
PackageSMD5032
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TAXM25M2QLFCDT1T
Type
YJX
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TAXM25M2QLFCDT1T
Electronic Component
1
Package
SMD5032
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.179g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0264209290
Operating Temperature
40℃~+85℃
Electronic Component
±30ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAXM25M2QLFCDT1T 产品概述

一、产品简介

TAXM25M2QLFCDT1T(品牌:YJX/雅晶鑫)是一款国产贴片晶振,基频25.000MHz,封装为SMD5032(5.0×3.2mm)。该器件针对工业级电子产品设计,工作温度范围为-40℃至+85℃,适合对频率稳定性和体积有要求的通信、微控制器时钟、网络设备及消费类电子应用。

二、主要技术参数

  • 类型:贴片晶振(SMD5032)
  • 标称频率:25.000 MHz
  • 常温频差(初始公差,25℃):±30 ppm
  • 频率稳定度:±20 ppm(厂家规范项,实际应用请参照完整数据手册)
  • 负载电容:20 pF
  • 等效串联电阻(ESR):30 Ω
  • 工作温度范围:-40℃ ~ +85℃
  • 制造:全国产(YJX 雅晶鑫)

三、器件特性与优势

  1. 小型化封装(SMD5032)便于高密度贴片布局,兼容自动贴装与回流焊工艺。
  2. 低ESR(30Ω)有利于振荡器电路快速启动并维持稳定振幅,适配常见CMOS/TTL振荡器输入。
  3. 宽温工作范围满足工业级要求,适合严苛环境下长期使用。
  4. 常温初始频差和频率稳定度配合,可在多数计时/时钟场景中提供可靠频率基准。
  5. 全国产供货链优势:易获取、快速交期和本地化技术支持。

四、典型应用场景

  • 微控制器/处理器时钟源(MCU、FPGA等)
  • 通信设备时钟(以太网PHY、射频前端参考等)
  • 网络设备与路由器的系统时钟
  • 精密测量与仪器仪表
  • 消费电子中的定时与同步电路

五、使用建议与电路匹配

  • 负载电容匹配:推荐外部两端对地电容C1=C2≈33 pF(取决于PCB寄生电容,一般认为寄生约2–3 pF,按公式 C ≈ 2*(CL - Cstray) 计算),以使实际负载电容接近20 pF。
  • 对于带内部负载电容的微控制器,请参考MCU手册决定是否需要外接电容或禁用内部电容。
  • ESR对启动性能有影响,30Ω适配绝大多数晶体振荡器输入级;若系统驱动能力较弱,可考虑在电路设计中保证足够的驱动增益。
  • 布局注意事项:晶振与振荡器输入引脚之间走线尽量短且等长,远离高速信号线与大电流回流路径,确保接地良好以减少相位噪声和干扰。

六、品质与可靠性

YJX(雅晶鑫)对该系列晶振提供出厂筛选和品质控制,满足常规电子制造与环境可靠性需求。具体的起振时间、老化特性及温漂曲线建议参照产品数据手册和加速试验报告进行评估。

七、选型提示

  • 若应用对频率精度或温漂有更高要求,可考虑更高等级的频差/稳定度选项或温补/恒温晶振(TCXO/OCXO)。
  • 在高频抖动或相位噪声敏感的系统(如高端通信或精密测量)应询问厂方提供更详细的相位噪声与噪声谱数据。
  • 量产前建议进行系统级验证,包括起振可靠性、长期老化与温度循环测试。

如需完整数据手册、封装图或样品评估支持,可联系YJX(雅晶鑫)或指定供应商获取更详尽的技术资料与测试报告。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.