Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
F25208MUBCE2O
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YJX F25208MUBCE2O
- Type
- YJX
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YJX
- Electronic Component
- F25208MUBCE2O
- Electronic Component
- 1
- Package
- SMD2520-4P
- Electronic Component
- Active Crystal Oscillator
- Electronic Component
- 0.042g
- Frequency
- 8MHz
- Electronic Component
- 1
- Electronic Component
- BM0264981811
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.8V~3.3V
- Operating Current
- 5mA
- Electronic Component
- ±10ppm
- Output
- CMOS
- Frequency
- ±10ppm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
F25208MUBCE2O 8MHz CMOS输出贴片晶振产品概述
一、产品基本定位与应用场景
F25208MUBCE2O是雅晶鑫（YJX） 推出的一款工业级小型化贴片晶振，核心功能是为数字系统提供稳定的8MHz时钟基准。产品体积紧凑、电压兼容范围宽、温度稳定性好，适用于以下典型场景：
- 消费电子：智能手机、平板电脑、智能手表等便携设备的MCU时钟源；
- 工业控制：PLC模块、传感器节点、电机控制器的时序基准；
- 通信设备：路由器、交换机、无线AP的射频/基带时钟；
- 物联网终端：智能家居网关、智能电表、环境监测仪的低功耗时钟需求。
二、核心参数详解
产品关键参数完全覆盖通用数字系统的时钟精度与兼容性要求，具体如下：
参数项 规格值 意义说明 标称频率 8MHz 时钟输出的标准基准频率 常温频差（25℃） ±10ppm 常温下频率偏差≤±80Hz（8MHz×10ppm），满足常规精度需求 输出模式 CMOS 数字电平输出，与TTL/CMOS逻辑芯片直接兼容 工作电压范围 1.8V~3.3V 覆盖低功耗（1.8V）与常规电压（3.3V）设备 典型工作电流 5mA 兼顾稳定性与功耗，适合电池供电终端 频率稳定度 ±10ppm 工作温度/电压波动下，频率变化≤±10ppm 工作温度范围 -40℃~+85℃ 工业级宽温，适应户外、车载等恶劣环境三、封装与引脚布局
产品采用SMD2520-4P 贴片封装，尺寸为2.5mm×2.0mm×0.8mm，符合小型化高密度PCB设计要求。引脚定义遵循行业标准：
- 引脚1：X1（晶振输入）；
- 引脚2：X2（晶振输出）；
- 引脚3：VCC（电源正）；
- 引脚4：GND（电源地）。
引脚间距0.8mm，支持自动化贴装（SMT），焊接工艺与普通贴片元件兼容。
四、性能优势分析
相比同类通用晶振，F25208MUBCE2O具备以下核心优势：
- 宽电压兼容性：1.8V~3.3V覆盖90%以上主流数字芯片电压，无需额外电平转换电路；
- 工业级可靠性：-40℃+85℃工作温度，通过振动（102000Hz，1g）、冲击（1000g，1ms）测试，适应工业现场恶劣环境；
- 稳定的频率特性：常温频差与温度稳定度均为±10ppm，避免因时钟偏移导致系统误码、时序错误；
- 小型化设计：SMD2520封装比传统DIP封装节省70%以上PCB空间，适合便携设备与高密度电路板；
- 品牌保障：雅晶鑫（YJX）专注晶振研发10余年，产品通过RoHS认证，批量一致性好。
五、应用注意事项
为保证产品性能稳定，需注意以下设计细节：
- 焊接工艺：回流焊峰值温度≤260℃，单次焊接时间≤10s，避免高温损坏晶振内部石英晶体；
- 电源滤波：VCC引脚并联0.1μF陶瓷电容到地，滤除电源噪声，防止输出抖动；
- 负载电容匹配：CMOS晶振需外接10~20pF负载电容（X1/X2到地各接一个），需根据datasheet选择匹配值，避免频率偏移；
- PCB布局：晶振引脚附近避免布高频信号线，GND引脚尽量靠近主电源地，减少电磁干扰耦合。
六、总结
F25208MUBCE2O是一款高性价比的工业级8MHz贴片晶振，凭借宽电压、宽温、小型化等优势，可满足消费电子、工业控制、物联网等多领域的时钟需求。产品参数稳定、兼容性强，是数字系统时钟设计的优选方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
