WMSIC Electronic Components

TX322512M4FBCE2T

ModelTX322512M4FBCE2T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TX322512M4FBCE2T
Type
YJX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TX322512M4FBCE2T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.034g
Frequency
12MHz
Electronic Component
1
Electronic Component
BM0264594689
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TX322512M4FBCE2T 产品概述

一、产品简介

TX322512M4FBCE2T 是雅晶鑫(YJX)全国产贴片晶振,采用 SMD3225-4P 封装(3.2 × 2.5 mm 小型化封装),额定工作频率 12.000 MHz,专为单片机、通信模组、消费电子及精密时钟电路提供稳定时基而设计。器件体积小、性能稳定、易于贴装,适用于大批量 SMT 生产与现代化电子产品的高密度电路板。

二、主要参数

  • 品牌:YJX(雅晶鑫)
  • 型号:TX322512M4FBCE2T
  • 晶振类型:贴片晶振(SMD)
  • 频率:12.000 MHz
  • 常温频差(Initial Tolerance, 25℃):±10 ppm
  • 频率稳定度(含温度等因素):±30 ppm
  • 负载电容(CL):12 pF
  • 等效串联电阻(ESR):60 Ω(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SMD3225-4P(4 引脚稳定支撑,便于 PCB 贴装)

三、产品特性

  • 小型化封装,适合高密度 PCB 设计;
  • 优良的频率精度与稳定性:常温初始偏差 ±10 ppm,整体稳定度 ±30 ppm,能满足多数嵌入式与通信设备的时钟精度需求;
  • 低至 60 Ω 的 ESR,便于与常见 MCU/振荡器电路匹配;
  • 宽工作温度范围,适用于工业级环境的长期运行;
  • 全国产化,交期可控且易于配套供应链管理。

四、典型应用

  • 单片机(MCU)时钟源;
  • 无线通信模组、蓝牙/Wi‑Fi 子系统;
  • 工业控制与测量仪器;
  • 消费类电子(数码相机、机顶盒、智能家居设备等);
  • 任何需要 12 MHz 精确参考时钟的系统。

五、使用建议与电路设计要点

  • 负载电容选型:器件标称 CL = 12 pF。若使用两颗对称的电容 C1、C2,则满足关系 CL ≈ (C1·C2)/(C1+C2) + Cstray。考虑 PCB 杂散电容(通常 2–5 pF),推荐 C1=C2 选型范围约 15 pF ~ 22 pF(典型取值 18 pF)。实际取值应在目标电路上测量并微调以获得最佳振荡启动与频率精度。
  • 与 MCU/振荡芯片匹配:ESR = 60 Ω,确认目标振荡器电路的驱动能力与阻抗匹配,避免因负载过重导致启动困难或振荡不稳。
  • PCB 布局建议:晶振与 MCU 振荡引脚走线最短最直,负载电容靠近 MCU 引脚并接地;避免晶振附近有强电流回路或高频噪声源;为提高抗干扰性,建议在晶振附近做良好接地。
  • 焊接与工艺:兼容常规回流焊工艺,建议按照供应商提供的回流曲线与贴装注意事项进行,避免过热或重复回流。
  • 防护与存储:存放环境避免潮湿、高温及污染,贴片包装(卷带)在生产前按供应商建议回潮烘烤处理(如适用)。

六、可靠性与采购信息

  • 产地:国产(雅晶鑫);
  • 包装方式:常见为卷带(Tape & Reel),适合 SMT 自动贴装;具体包装、最小订购量与交货期请向供应商或代理确认;
  • 质量控制:出厂后经过频率检测与筛选,建议在关键应用中进行样机验证。

如需样品测试、详细封装尺寸图、回流焊曲线或长期可靠性数据(如老化率、温漂曲线),可联系雅晶鑫技术支持或指定代理商获取原厂技术资料与测量报告。

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