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T322530MLBDD2X
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YJX T322530MLBDD2X
- Type
- YJX
- Minimum package
- 3000 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YJX
- Electronic Component
- T322530MLBDD2X
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.039g
- Frequency
- 30MHz
- Electronic Component
- 1
- Electronic Component
- BM0264778276
- Operating Temperature
- 30℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
T322530MLBDD2X 产品概述
一、概述
T322530MLBDD2X 是雅晶鑫（YJX）推出的一款国产贴片晶振，封装为 SMD3225-4P（3.2 × 2.5 mm），标称频率 30.000 MHz。该器件针对现代 SMT 贴装和自动化生产设计，适合需要高精度、低体积时钟源的电子系统，如微控制器时钟、通信模块、PLL 参考源与消费类电子设备等。
二、主要参数
- 品牌：YJX（雅晶鑫）
- 型号：T322530MLBDD2X
- 封装：SMD3225-4P（3225）
- 频率：30.000 MHz
- 常温频差（初始公差）：±10 ppm
- 频率稳定度（温度范围内整体）：±20 ppm
- 负载电容：20 pF
- 等效串联电阻（ESR）：30 Ω
- 工作温度：-30 ℃ ～ +85 ℃
三、产品特点
- 高频率、体积小：30 MHz 工作频率满足大多数中高频时钟需求，3225 尺寸便于空间受限设计。
- 精度与稳定性：常温初始公差 ±10 ppm，整体温度稳定度 ±20 ppm，适合对频率精度有中高要求的应用。
- 良好互换性：标准负载电容 20 pF，便于与 MCU 和振荡器电路匹配。
- SMT 兼容：适用于贴片回流焊工艺，利于自动化装配和批量生产。
四、典型应用
- 单片机和DSP时钟源
- 通信模块（无线收发、基带芯片参考）
- 测试与测量设备参考时钟
- 高清视频/音频同步与数字电路时钟
五、使用建议
- 负载电容匹配：晶振标称 CL=20 pF，实际电路中两端电容 C1、C2 与电路寄生电容共同决定实际负载。设计时可参照公式 CL ≈ (C1·C2)/(C1+C2) + Cstray，通常在 PCB 与输入电路寄生电容约 2–5 pF 情况下，建议 C1=C2 选型约 30–36 pF 以获得接近 20 pF 的实际负载（最终以实际测量和目标电路的振荡器规范为准）。
- ESR 与驱动能力：等效串联电阻 30 Ω，对应某些高增益或高驱动要求的振荡器可能需要注意启动时间与稳定性，建议按目标芯片数据手册调节反馈网络或选择合适的晶体驱动配置。
- 焊接与工艺：适用于回流焊，建议遵循厂方推荐的回流温度曲线与焊接工艺，避免超温或长时间高温以防频率漂移或损伤。
- 存储和装配注意：避免强烈机械应力、弯折和冲击；清洗时避免使用可能对晶体造成损伤的超声波工艺；贴装后尽量避免二次加热或冲击。
六、包装与订购
T322530MLBDD2X 适配 SMT 生产线，常见为卷带包装以利于贴片机扩展使用。订购或样片需求请注明型号、频率与频差要求，并与供应商确认出货检验报告（如频率计量、ESR 测试、温度特性等）以满足量产一致性需求。
如需更详细的封装尺寸图、回流曲线或测试曲线，可联系供应商获取完整数据手册与应用参考资料。
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