WMSIC Electronic Components

TNXM32768K2NFCDCZT2T

ModelTNXM32768K2NFCDCZT2T
PackageSMD3215-2P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TNXM32768K2NFCDCZT2T
Type
YJX
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TNXM32768K2NFCDCZT2T
Electronic Component
1
Package
SMD3215-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.043g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264778289
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
9pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TNXM32768K2NFCDCZT2T 产品概述

一、产品简介

TNXM32768K2NFCDCZT2T 是雅晶鑫(YJX)出品的一款国产贴片32.768 kHz 石英晶体谐振器,封装为 SMD3215-2P(3.2 × 1.5 mm 两端子)。该器件面向实时时钟(RTC)与超低功耗振荡应用,常温频差±20 ppm,负载电容标称为 9 pF,频率稳定度 ±30 ppm,等效串联电阻(ESR)为 70 kΩ,工作温度范围 -40 ℃~+85 ℃。

二、主要特性

  • 标称频率:32.768 kHz(适用于二进制时间分频的标准频点)
  • 常温频差:±20 ppm(出厂基准精度)
  • 频率稳定度:±30 ppm(典型环境/温度影响范围)
  • 负载电容:9 pF(晶体设计目标负载)
  • 等效串联电阻(ESR):70 kΩ(影响起振时间与驱动能力)
  • 工作温度:-40 ℃~+85 ℃(工业级温区)
  • 封装:SMD3215-2P,适配自动贴片与回流焊工艺
  • 品牌:YJX(雅晶鑫),国产产线,可供长期供货

三、典型应用

  • 微控制器/RTC 实时时钟晶体振荡器
  • 手表、计时器与计量设备
  • 低功耗物联网终端、遥测节点、传感器模组
  • 医疗便携设备与工业控制系统的时间基准

四、选型与电路建议

  • 负载电容选择:晶体标称 CL = 9 pF。实际电路中需考虑 PCB 与引线的分布电容(Cstray,通常 1.5–3 pF)。满足公式 CL ≈ (C1·C2)/(C1+C2) + Cstray,可取 C1 = C2 ≈ 12–15 pF 作为常见起点,最终值可经实测微调以获得准确频率。
  • 启动与 ESR:ESR = 70 kΩ 较高,会增加启动时间并要求 MCU/振荡器内核具备足够驱动能力或更长的起振等待时间。请确认目标 MCU 的振荡驱动电平与推荐 ESR 范围相匹配。
  • 布线注意:晶体与 MCU 振荡器脚应尽量靠近,减少走线长度与并行干扰;振荡引脚附近避免大电流回路或数字噪声源。
  • 温漂与频率校准:若系统对长期或温度下的时间精度要求更高,建议在固件中做温度补偿或使用校准表/校准点。

五、封装与焊接建议

  • SMD3215-2P 小封装适用于自动化贴装与回流焊流程。
  • 建议按制造商提供的回流焊曲线与焊接工艺规范进行焊接,避免剧烈温度冲击与超出推荐峰值温度。
  • 贮存与处理:避免潮湿与强机械冲击,贴片后应在建议的湿度控制时限内回流。

六、订购与品质保证

  • 型号:TNXM32768K2NFCDCZT2T(YJX 雅晶鑫)
  • 封装:SMD3215-2P;频率:32.768 kHz;负载:9 pF;ESR:70 kΩ;温度范围:-40~+85 ℃。
  • 本产品为国内产线生产,适合批量采购与长期供货。对于可靠性测试、老化筛选或特殊温漂要求,建议与供应商沟通定制测试或更严苛的筛选方案。

如需样品测试、详细封装尺寸图、回流焊曲线或与特定 MCU 搭配的起振测试数据,可提供型号要求,我方可协助获取或进行评估建议。

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