WMSIC Electronic Components

TFOM50M4RHKCNT2T

ModelTFOM50M4RHKCNT2T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TFOM50M4RHKCNT2T
Type
YJX
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TFOM50M4RHKCNT2T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.05g
Frequency
50MHz
Electronic Component
1
Electronic Component
BM0264498436
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~5V
Operating Current
25mA
Electronic Component
±50ppm
Output
CMOS
Frequency
±50ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TFOM50M4RHKCNT2T 50MHz CMOS输出晶振产品概述

一、产品核心定位

TFOM50M4RHKCNT2T是雅晶鑫(YJX)推出的工业级小尺寸时钟晶振,主打50MHz核心频率、CMOS输出、宽电压适配与宽温可靠性,针对数字电路设计中对时钟精度、体积紧凑性、环境适应性有明确需求的场景,兼具高性价比与稳定性能,是工业控制、通信设备、消费电子等领域的常用时钟基准器件。

二、关键性能参数详解

该晶振的核心参数经过针对性优化,覆盖数字电路设计的核心需求:

  1. 频率与精度:标称频率50MHz,常温(25℃)下频差控制在±50ppm以内(即实际频率偏差≤2.5kHz),频率稳定度同样为±50ppm——前者是偏离标称值的绝对精度,后者是随温度/电压变化的相对稳定性,双参数均满足工业级时钟同步的基础要求。
  2. 输出特性:采用CMOS逻辑输出,电平兼容TTL/CMOS数字电路(高电平≥0.8VDD,低电平≤0.2VDD),输出阻抗低(典型值≤100Ω),驱动能力强,可直接连接MCU、FPGA、通信芯片等IC的时钟输入端,无需额外添加缓冲电路,简化系统设计。
  3. 电源适配:工作电压范围为1.8V~5V宽电压,覆盖主流数字电路供电场景(如低功耗MCU的1.8V、通用MCU的3.3V、传统电路的5V),无需额外电平转换模块,降低系统成本。
  4. 功耗控制:典型工作电流为25mA,在同类50MHz晶振中属于中低功耗水平,适合电池供电的便携设备(如智能穿戴)或功耗敏感的工业模块。
  5. 封装与引脚:采用SMD3225-4P贴片封装,尺寸仅3.2mm×2.5mm×0.8mm,符合RoHS环保标准;4引脚布局(通常为电源、地、输出、使能/NC),焊接兼容性好,适合高密度PCB设计。

三、工作环境适应性

该晶振支持**-40℃+85℃的工业级温度范围**,远宽于消费级器件的0℃70℃,可适应户外设备(如无线传感器)、车载电子(如ADAS辅助驾驶)、工业现场(如PLC控制柜)等极端温度场景;同时,其频率稳定度随温度变化的偏差控制在±50ppm内,确保宽温下时钟精度不出现明显漂移。

四、典型应用领域

结合参数特点,TFOM50M4RHKCNT2T的核心应用场景包括:

  1. 工业控制设备:PLC可编程控制器、伺服驱动器、工业传感器模块的时钟基准,宽温与精度满足现场恶劣环境需求;
  2. 通信设备:路由器、交换机、无线AP的时钟同步(如以太网接口的波特率基准),CMOS输出兼容通信芯片接口;
  3. 消费电子:智能手环、便携医疗设备的时钟源,小封装适配小型化设计,宽电压适配不同供电方案;
  4. 车载电子:车载导航、行车记录仪、ADAS系统的时钟模块,宽温范围适应车载环境的温度波动。

五、选型与使用注意事项

  1. 精度匹配:若系统需更高精度(如±10ppm用于高精度通信),需选择同品牌的高精度型号;若仅需基础时钟(如LED驱动),该型号的±50ppm足够;
  2. 焊接工艺:建议采用回流焊(温度曲线符合J-STD-020标准),避免手工焊接时的局部过热损伤晶振内部结构;
  3. PCB布局:晶振应尽量靠近时钟输入端,走线长度≤2cm,避免与高频信号线平行(减少EMI干扰),电源引脚可并联0.1μF陶瓷电容滤波;
  4. 环保要求:符合RoHS无铅标准,可用于出口设备或环保要求严格的项目。

该晶振通过了常见可靠性测试(如振动、冲击、湿热),可长期稳定工作,是数字电路设计中平衡性能与成本的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.