WMSIC Electronic Components

F322512MUBCE2O

ModelF322512MUBCE2O
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX F322512MUBCE2O
Type
YJX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
F322512MUBCE2O
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.054g
Frequency
12MHz
Electronic Component
1
Electronic Component
BM0264981813
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.3V
Operating Current
5mA
Electronic Component
±10ppm
Output
CMOS
Frequency
±10ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

F322512MUBCE2O 石英晶体振荡器产品概述

一、产品核心参数总览

F322512MUBCE2O是雅晶鑫(YJX)推出的工业级表面贴装石英晶体振荡器,核心参数覆盖频率基准、电气特性、环境适配三大维度,具体如下:

参数类别 具体参数 说明 基本频率 12MHz 主流数字电路常用基准频率 常温频差 ±10ppm 25℃环境下频率偏差控制在工业级精度范围 频率稳定度 ±10ppm(-40℃~+85℃) 全工作温度范围内频率波动极小 输出模式 CMOS 兼容TTL/CMOS逻辑电平,无需电平转换 工作电压范围 1.8V~3.3V DC 覆盖多数MCU、传感器的供电需求 典型工作电流 5mA(3.3V下) 低功耗设计,适配电池供电设备 封装类型 SMD3225-4P 3.2×2.5mm小型化封装,节省PCB空间 工作温度范围 -40℃~+85℃ 工业级宽温,适配户外/车载等严苛场景

二、关键性能特性解析

1. 宽电压与低功耗的平衡

1.8V~3.3V的电压范围可直接匹配STM32低功耗系列、51单片机、蓝牙模块等主流芯片,无需额外DC-DC转换电路;5mA的典型工作电流在同频率、同封装晶振中处于前列,能有效延长电池供电设备(如智能手环、IoT节点)的续航时间。

2. 稳定的频率表现

±10ppm的常温频差和全温稳定度,可满足工业控制、通信接口的精度要求:例如12MHz作为UART波特率(如115200bps)的倍频源时,频率偏差小于0.1%,可避免数据传输丢包;在PLC模块中,稳定的时钟能保证电机控制、传感器采样的时序一致性。

3. 小封装适配高密度集成

SMD3225-4P封装尺寸仅3.2mm×2.5mm,比传统DIP封装缩小60%以上,适合智能家居控制器、智能手表等小型化产品;4引脚布局符合行业通用标准(通常1脚输出、2脚地、3脚电源、4脚悬空),焊接兼容性强。

4. 工业级环境可靠性

-40℃~+85℃的工作温度范围,可覆盖车间、户外基站、车载电子等场景的温度变化;雅晶鑫的石英晶体工艺确保产品抗振动、抗冲击性能,符合IEC 60068-2-6等可靠性标准。

三、典型应用场景

1. 工业控制领域

PLC模块、电机控制器、传感器节点等设备需稳定时钟保证控制时序,F322512MUBCE2O的宽温特性可适配-20℃~+70℃的车间环境,避免温度波动导致的频率漂移。

2. 消费电子便携设备

智能手表、蓝牙耳机、智能家居遥控器等产品对尺寸和功耗敏感,小封装+低功耗设计可满足PCB空间紧凑、续航要求高的需求。

3. 物联网(IoT)终端

温湿度传感器、智能门锁、无线网关等IoT节点需稳定时钟支持WiFi/蓝牙通信,12MHz基准可保证协议栈的正常运行,宽电压适配不同电池供电方案。

4. 通信接口电路

UART、SPI、I2C等接口的基准时钟,12MHz是常见波特率(9600bps、115200bps)的倍频源,CMOS输出可直接驱动数字电路,无需缓冲器。

四、选型与使用注意事项

  1. 焊接工艺:建议采用回流焊(温度曲线符合J-STD-020标准,峰值温度≤260℃),避免手工焊接时烙铁温度过高损坏晶振内部石英片;
  2. 负载电容匹配:部分应用需并联10pF~22pF陶瓷电容(参考官方datasheet推荐值),提升频率稳定性;
  3. 电源滤波:在VCC引脚附近并联0.1μF陶瓷电容,抑制电源噪声对时钟的干扰;
  4. 替换兼容性:若替换其他品牌晶振,需确认封装尺寸、引脚定义、输出模式完全一致,避免系统故障。

F322512MUBCE2O凭借“宽温、宽压、小封装、高稳定”的综合优势,成为工业控制、消费电子、IoT等领域的高性价比时钟源选择,可有效简化系统设计并提升设备可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.