WMSIC Electronic Components

TXM24M0004322KBCDO00T

ModelTXM24M0004322KBCDO00T
PackageSMD3225-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TXM24M0004322KBCDO00T
Type
YJX
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TXM24M0004322KBCDO00T
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.05g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0264594692
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
18pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TXM24M0004322KBCDO00T 无源贴片晶振产品概述

TXM24M0004322KBCDO00T是雅晶鑫(YJX)推出的通用型无源贴片晶振,针对中低端电子设备的稳定时钟需求设计,采用SMD3225小型化封装,具备平衡的性能参数与工业级环境适应性,是多数数字电路时钟源的高性价比选择。

一、产品基本定位与品牌背景

雅晶鑫(YJX)作为国内晶体谐振器领域的专业厂商,产品覆盖无源/有源晶振、振荡器等系列,广泛应用于消费电子、工业控制等领域。TXM24M0004322KBCDO00T属于该品牌无源晶振的SMD3225封装系列,主打“低成本+稳定可靠”定位,无需额外驱动电路即可工作,适配多数MCU、FPGA等数字芯片的内部振荡模块。

二、核心性能参数详解

该晶振核心参数明确且贴合通用时钟需求,具体如下:

  • 频率:24MHz,数字电路常用系统时钟频率,可直接适配多数8位/32位MCU的默认配置;
  • 常温频差:±10ppm,常温(25℃)下频率偏差为24MHz×10ppm=240Hz,满足消费电子、一般工业设备精度要求;
  • 负载电容:18pF,无源晶振需外部负载电容匹配以实现稳定振荡,该参数明确了电路设计的等效负载电容值;
  • 频率稳定度:±20ppm,工作温度范围内(-40℃~+85℃)频率相对常温的最大偏移为24MHz×20ppm=480Hz,适应宽温环境;
  • 等效串联电阻(ESR):30Ω,ESR越低则振荡电路越易起振且稳定性越好,30Ω处于SMD3225封装晶振的常规偏低水平;
  • 工作温度范围:-40℃~+85℃,覆盖工业级温宽,可用于户外、车载等温度敏感场景。

三、封装与物理特性

TXM24M0004322KBCDO00T采用SMD3225-4P封装,尺寸3.2mm×2.5mm(行业标准3225规格),4引脚贴片设计,适配表面贴装工艺(SMT),优势在于:

  • 小型化:满足智能穿戴、小型传感器等设备的空间限制;
  • 低寄生参数:无引脚设计减少时钟信号的寄生电容/电感,提升信号质量;
  • 焊接兼容:符合主流回流焊温度曲线,易集成自动化生产流程。

四、环境适应性与可靠性

作为无源晶振,该产品无内置有源驱动电路,仅依赖外部振荡模块工作,具备以下可靠性优势:

  • 宽温稳定:-40℃~+85℃温宽内频率漂移可控,满足工业级环境要求;
  • 低失效率:无有源器件老化问题,长期工作可靠性高于有源晶振;
  • 抗干扰性:信号输出受外部干扰影响较小,适合复杂电磁环境。

五、典型应用领域

该晶振的性能与封装特性决定了其适合以下场景:

  1. 消费电子:智能穿戴(手表、手环)时钟模块、智能家居网关/传感器节点系统时钟;
  2. 工业控制:小型PLC、电机控制器、数据采集模块参考时钟;
  3. 无线通信:蓝牙BLE、ZigBee等低速率无线模块时钟源;
  4. 车载电子:车载信息娱乐系统辅助时钟、胎压监测(TPMS)模块时钟(非安全关键级); 注:精度有限,不适合通信基站、精密仪器等高精度场景。

六、选型与应用注意事项

为确保正常工作,需注意以下要点:

  1. 负载电容匹配:按18pF配置外部负载电容,通常晶振两端各接18pF电容到地(需考虑PCB寄生电容,实际值可微调);
  2. 振荡电路兼容:确认MCU/IC内部OSC模块支持24MHz无源晶振,且ESR阈值≤30Ω(多数MCU满足);
  3. 焊接工艺:遵循SMD3225回流焊曲线(峰值温度245℃±5℃,时间≤30s),避免过热损坏;
  4. 信号抗干扰:时钟线远离高频干扰源(电源、射频模块),必要时增加屏蔽或匹配电阻。

总结

TXM24M0004322KBCDO00T凭借平衡的性能、小型化封装与工业级温宽,成为中低端电子设备时钟源的高性价比选择,适合对精度要求不苛刻但需稳定时钟的应用场景,是雅晶鑫无源晶振系列中的成熟产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.