Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TXM24M0004322DBCDO00T是雅晶鑫(YJX)推出的无源贴片晶振,型号编码直接对应其性能与封装特征。该产品无内置振荡电路,需配合外部振荡电路(如MCU、FPGA内置振荡器)实现频率输出,结构简单且可靠性突出;采用SMD3225-4P封装(3.2×2.5mm贴片尺寸,4引脚),属于小型化晶振,适配电子设备轻薄化需求。
该晶振核心参数均衡,满足多数中高精度频率场景需求:
采用SMD3225-4P贴片封装,尺寸仅3.2mm×2.5mm×0.8mm(典型高度),适配自动化贴片机高速贴装,可提升批量生产效率;4引脚设计保证焊接可靠性,避免虚焊问题,适合消费电子、工业设备的规模化生产。
工作温度范围为**-40℃~+85℃**,覆盖工业级、车载级宽温需求,无需额外加热/散热即可稳定工作。结合±20ppm频率稳定度,极端温度下(如-40℃低温、+85℃高温)频率漂移仍控制在合理范围,满足户外设备、工业控制等恶劣环境应用。
因性能均衡、尺寸小巧、宽温适配,该晶振广泛应用于:
雅晶鑫(YJX)作为国内频率元器件厂商,产品通过ISO9001认证;TXM24M0004322DBCDO00T经过高低温循环(-40℃+85℃,100次)、振动(102000Hz,1.5g)、冲击(1000g半正弦波) 等可靠性测试,符合IEC 60068-2标准;无源晶振无内置电路设计,典型MTBF≥10^6小时,可长期稳定工作。
该产品凭借小型化、宽温适配、高可靠性等特点,成为中低端频率需求场景的优选无源晶振。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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