Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TXM25M0004252KBCEO00T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YJX TXM25M0004252KBCEO00T
- Type
- YJX
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YJX
- Electronic Component
- TXM25M0004252KBCEO00T
- Electronic Component
- 1
- Package
- SMD2520-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.034g
- Frequency
- 25MHz
- Electronic Component
- 1
- Electronic Component
- BM0264209322
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 18pF
- Frequency
- ±30ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TXM25M0004252KBCEO00T 产品概述
一、产品简介
TXM25M0004252KBCEO00T 是雅晶鑫（YJX）出品的贴片晶振，基准频率 25.000 MHz，封装为 SMD2520-4P（约 2.5 × 2.0 mm）。该器件面向体积敏感且需高精度时钟源的消费类与工业电子产品，具有良好的温度和频率稳定性能，适用于表贴自动化贴装与回流焊工艺。
二、主要特性
- 标称频率：25 MHz
- 常温频差：±10 ppm（25°C）
- 频率稳定度（含温度影响）：±30 ppm
- 负载电容：18 pF
- 等效串联电阻（ESR）：45 Ω
- 工作温度范围：-40°C ~ +85°C
- 封装：SMD2520-4P，支持带卷包装（Tape & Reel）
- 品牌：YJX（雅晶鑫）
三、典型电路与选件
晶体谐振回路需与 MCU 或振荡器输入相匹配。选择外置电容时，遵循公式：CL = (C1·C2)/(C1+C2) + Cstray。若采用对称电容 C1 = C2，可近似取 C1 ≈ 2·(CL − Cstray)。以 CL=18 pF、PCB 布线寄生 Cstray ≈ 2–5 pF 为例，推荐 C1=C2 约为 26–32 pF（常用 27 pF）。由于 ESR 为 45 Ω，确保振荡器驱动能力足够启动并维持振荡，避免过大负载或过高驱动电平造成失谐或寿命问题。
四、封装与焊接
SMD2520-4P 支持回流焊工艺，建议遵循 JEDEC/IPC 回流曲线进行回流焊接，避免超过器件耐热极限。储运与贴装过程中注意防潮、静电防护，必要时按厂方提供的湿敏等级（MSL）要求处理。推荐在器件附近留出合适焊盘与地铜，减小寄生电容并保证机械强度。
五、应用场景
适用于：
- 微控制器/微处理器系统的时钟源
- 通信模块与网络接口参考时钟（如部分 25 MHz 应用）
- 工业控制、仪器仪表与消费电子（电视、机顶盒、机顶模块等）
- 时钟发生器、音视频同步电路
六、质量与订购信息
雅晶鑫提供成品测试（频率、负载、ESR、工作温度测试）与批次追溯。常见包装为 7/13 英寸卷带（Tape & Reel），支持小批量样品与大批量交付。订购请注明完整型号 TXM25M0004252KBCEO00T、数量、交货期及特殊检验需求，如需可靠性试验报告或定制温度曲线可与供应商技术支持联系。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
