WMSIC Electronic Components

T60358MKDDD1X

ModelT60358MKDDD1X
PackageSMD6035-2P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX T60358MKDDD1X
Type
YJX
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
T60358MKDDD1X
Electronic Component
1
Package
SMD6035-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.144g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264209308
Operating Temperature
30℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
18pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

T60358MKDDD1X 产品概述

一、产品简介

T60358MKDDD1X 为雅晶鑫(YJX)全国产贴片晶振,标称频率 8.000MHz,面向工业级与通用电子产品时钟源需求。该器件采用 SMD6035-2P 封装,外形紧凑,适合表面贴装工艺,提供稳定、低杂讯的频率输出,适用于单片机、实时时钟、通信模块及各种计时/定时电路。

二、主要电气参数

  • 标称频率:8.000 MHz
  • 常温频差(初始频差):±20 ppm
  • 频率稳定度(包含温度项):±20 ppm
  • 等效串联电阻(ESR):30 Ω
  • 负载电容:18 pF(标称)
  • 工作温度范围:-30 ℃ ~ +85 ℃

以上参数反映了该晶振在常温及工业温度范围内的稳态性能,适合对频率精度有一定要求但不需高精密温补晶振(TCXO/OCXO)的场合。

三、封装与机械要求

器件采用 SMD6035-2P 表贴封装(公称尺寸约 6.0 × 3.5 mm),2 引脚设计便于贴装与回流焊接。贴片面积与厚度适中,便于在空间受限的板上布局。建议在贴装时参考厂家推荐的 PCB 焊盘过孔与焊盘尺寸,保持焊接一致性以保证机械与电性能稳定。

四、使用与布局建议

  • 贴片位置:晶振尽量靠近 MCU/振荡器输入引脚放置,以缩短走线并降低寄生电容与干扰。
  • 走线原则:两根连接引脚的走线应尽量短且对称,避免经过高频、高电流走线和敏感模拟电路。
  • 地平面:在晶振附近提供连续地平面,有助于减少 EMI 干扰并稳定振荡环境。
  • 负载电容选择:标称负载电容为 18 pF,若使用对称电容 C1 = C2,可按公式计算 C ≈ 2*(CL − Cs),其中 Cs 为器件及 PCB 的寄生并联电容(常见 23 pF)。对于 CL=18 pF,常用 C1、C2 推荐值约 3033 pF。
  • 启动与驱动:ESR 30 Ω 在大多数微控制器内部晶体振荡器驱动能力范围内能正常启动,但在驱动能力较弱的振荡器或要求快速启动的场合,应在设计中验证启动时间与稳定性。

五、典型应用

  • 单片机系统(MCU 时钟源)
  • 实时时钟(RTC)模块
  • 工业控制与仪表
  • 消费类电子与通信终端的定时/频率参考

六、焊接与存储注意事项

  • 建议遵循无铅回流焊工艺规范并参照厂方回流温度曲线;通常无铅回流峰值温度不超过 260 ℃。
  • 存储与搬运过程中应防潮、防尘并采取防静电措施,避免受潮后回流焊出现焊点缺陷。
  • 长期存放建议在原包装条件下保存,避免高温、高湿及强烈振动环境。

七、选型提示与可靠性考量

该型号以性价比和国产供货稳定性为优势,适合大批量通用产品应用。选型时关注以下几点:若系统对频率精度或温漂有更严格要求,应考虑温补或恒温晶振;若振荡器驱动能力或启动时间关键,需在样机阶段验证 ESR 与启动行为;在高 EMI 环境中,请增加滤波与屏蔽措施以保证长期可靠工作。

如需样品、详细封装图或回流焊曲线与可靠性试验报告,可联系供应商获取更详细的技术资料。

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