WMSIC Electronic Components

TX50328M2FDCE1T

ModelTX50328M2FDCE1T
PackageSMD5032-2P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TX50328M2FDCE1T
Type
YJX
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TX50328M2FDCE1T
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.13g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264594685
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TX50328M2FDCE1T 贴片石英晶振产品概述

一、产品核心定位与基本参数

TX50328M2FDCE1T是雅晶鑫(YJX)推出的SMD5032-2P封装通用型贴片晶振,核心频率为8MHz,专为中小体积、对时钟稳定性有基础要求的电子设备设计。其关键参数覆盖主流应用场景:

  • 常温(25℃)频差控制在±20ppm以内,频率偏差约±160Hz(8MHz×20×10⁻⁶);
  • 工作温度范围宽至-40℃~+85℃,满足工业级设备的高低温波动需求;
  • 负载电容默认匹配12pF,等效串联电阻(ESR)典型值80Ω,全温范围频率稳定度±30ppm。

二、封装与结构设计

该晶振采用SMD5032-2P小型化贴片封装(尺寸约5.0mm×3.2mm×1.2mm),无传统引线设计,适配自动化SMT生产线,焊接效率高且一致性好。2引脚结构简化了电路连接,同时减少了寄生参数对时钟信号的干扰;封装材料选用耐高温陶瓷,可承受回流焊等高温制程(峰值温度≤260℃),抗机械振动性能优于直插型晶振,适合便携式设备或高密度PCB布局场景。

三、电气性能参数详解

1. 频率特性

核心频率8MHz为基频输出,无需额外泛音电路,信号纯净度高。常温频差±20ppm满足大多数数字电路(如MCU、单片机)的时钟精度要求;全温范围(-40~85℃)频率稳定度±30ppm,可覆盖户外设备、工业传感器等场景的温度波动。

2. 负载电容匹配

默认负载电容12pF,电路设计时需注意:PCB寄生电容(通常1~3pF)需计入总负载,实际外接电容应选择12pF减去寄生电容值(如寄生2pF则选10pF),否则会导致频偏超出规格。

3. 等效串联电阻(ESR)

典型值80Ω,属于同频率同封装晶振的常规水平。需注意振荡电路的放大倍数需≥5倍ESR对应的损耗,避免因ESR过大导致停振或输出幅度不足。

四、环境适应性

  1. 温度范围:-40℃+85℃,超过消费级晶振的070℃范围,可用于户外安防摄像头、工业仪表等场景;
  2. 机械性能:抗振动(10~2000Hz,加速度1.5g)、抗冲击(峰值1000g,持续0.1ms)满足IPC标准,适合运输过程中易受振动的设备;
  3. 湿度适应性:可在5%~95%相对湿度(无凝露)环境下长期工作,避免极端潮湿导致封装受潮或引脚氧化。

五、典型应用场景

该晶振因体积小、稳定性好,广泛应用于:

  • 消费电子:智能手表、蓝牙耳机、智能音箱等便携式设备;
  • 工业控制:PLC模块、传感器节点、小型工业仪表;
  • 通信设备:蓝牙4.0、ZigBee等低速率无线模块,小型路由器;
  • 汽车电子:胎压监测传感器、车载蓝牙小模块;
  • 智能家居:智能门锁、温湿度传感器。

六、选型与使用注意事项

  1. 负载电容匹配:必须根据PCB寄生电容调整外接电容,确保总负载为12pF;
  2. 焊接工艺:回流焊峰值温度≤260℃,每个引脚焊接时间≤10s,避免过热损坏;
  3. 静电防护:ESD等级1kV(人体模式),生产需佩戴防静电手环,使用防静电包装;
  4. 布局设计:远离高频电路(WiFi、开关电源),走线长度≤10mm,接地良好;
  5. 存储条件:未焊接晶振存储于035℃、30%70%湿度环境,避免长期暴露在潮湿空气中。

TX50328M2FDCE1T兼顾小体积与可靠性,是消费电子、工业、通信等领域的高性价比时钟源选择。

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