WMSIC Electronic Components

T49SM11.0592MLDBE2X

ModelT49SM11.0592MLDBE2X
PackageHC-49S-SMD
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX T49SM11.0592MLDBE2X
Type
YJX
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
T49SM11.0592MLDBE2X
Electronic Component
1
Package
HC-49S-SMD
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.933g
Frequency
11.0592MHz
Electronic Component
1
Electronic Component
BM0264778295
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

T49SM11.0592MLDBE2X 产品概述

一、产品简介

T49SM11.0592MLDBE2X 是雅晶鑫(YJX)出品的一款贴片晶振,工作频率为 11.0592 MHz,适用于以此频率为基准的单片机(MCU)、串口通信、时基电路及消费类电子等场合。器件采用 HC-49S-SMD 封装,面向 SMT 贴装工艺,具有良好的温度范围与频率稳定性,适合中低成本且要求稳定时钟源的应用。

二、主要参数

  • 频率:11.0592 MHz
  • 常温频差(Ta = 25°C):±20 ppm
  • 频率稳定度(包含温度影响等):±30 ppm
  • 负载电容:20 pF(标称)
  • 等效串联电阻(ESR):100 Ω(典型/最大值)
  • 工作温度范围:-20°C ~ +70°C
  • 封装:HC-49S-SMD(贴片型)
  • 品牌:YJX(雅晶鑫)
  • 产地:全国产

三、性能特点

  • 高频率准确度高:常温偏差仅 ±20 ppm,适合需要高精度波特率或定时的应用场景(如串口通信、定时器基准等)。
  • 稳定性良好:综合频率稳定度 ±30 ppm,可抵御一般工业或商业环境下的温度变化。
  • 兼容 SMT 贴装:HC-49S-SMD 封装便于使用贴片生产线,提高自动化装配效率。
  • 适用面广:通用频率节点,便于与常见 MCU(如 8051 系列、AVR、ARM 等)配合实现精确波特率或系统时钟。

四、应用建议

  • 单片机系统时钟与外部晶振(尤其需精确波特率的 UART 通信)
  • 串口、蓝牙模块、无线模组的波特率基准
  • 工业控制、家用电器及其他对中等频率稳定性有要求的设备
  • 时钟源替代件与维修备件市场

五、设计与使用注意事项

  • 负载电容配对:晶振标称负载为 20 pF,建议在晶振两端各并联一只电容 C1、C2,使并联等效满足 CL:当 PCB 杂散电容(Cstray)约 2–5 pF 时,建议 C1 = C2 ≈ 30–36 pF;常用取值为 33 pF。
  • 布线与走位:晶振附近应尽量远离高频信号线、时钟缓冲或开关电源引入的干扰;其接地应短且直接连到地平面。
  • 去耦与屏蔽:若环境噪声较大,可在晶振与 MCU 之间设置小距离,或在敏感区域加地线隔离/屏蔽。
  • 焊接工艺:HC-49S-SMD 设计适配 SMT 工艺,建议在正常的回流焊工艺条件下组装;为保证可靠性,注意避免过度机械应力与重复加热。
  • 储存与搬运:干燥、常温环境保存,避免潮湿和强振动;长时间存放建议防潮包装。

六、质量与包装

  • 产地:国内制造,符合一般电子元器件出厂检验流程(外观、频率测试、ESR 与温度循环等基本检测)。
  • 包装形式:常见为带装盘(Tape & Reel),便于 SMT 贴装线使用;亦可按需求小批量包装。

七、选型与采购建议

  • 若应用对频率精度或温度范围有更高要求,可向供应商咨询更高等级的频差/温度系数产品。
  • 采购时确认批次、规格书(数据手册)和测试报告,必要时索取样品进行实际系统测试(包括上电稳定性、启动时间及串扰敏感性)。

如需完整数据手册、尺寸图或贴片焊盘推荐图,请联系雅晶鑫(YJX)或代理商获取详细技术资料与样品支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.