WMSIC Electronic Components

TX50328M2KDCE1T

ModelTX50328M2KDCE1T
PackageSMD5032
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TX50328M2KDCE1T
Type
YJX
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TX50328M2KDCE1T
Electronic Component
1
Package
SMD5032
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.12g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264498418
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
18pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TX50328M2KDCE1T贴片晶振产品概述

TX50328M2KDCE1T是雅晶鑫(YJX)推出的一款小型化SMD贴片石英晶振,采用5.0×3.2mm标准封装,以8MHz核心频率为核心,兼顾精度、稳定性与环境适应性,适用于工业控制、消费电子、车载周边等多场景的时钟信号需求。

一、产品基本定位与封装特性

该产品属于小型化表面贴装晶振,采用行业通用SMD5032封装(典型尺寸5.0mm×3.2mm×1.2mm),符合自动化贴装工艺要求,可通过高速贴片机实现批量生产,大幅降低人工组装成本。封装采用陶瓷外壳密封,具备良好的防潮、抗冲击性能,能有效保护内部石英晶片,减少环境因素对晶振性能的影响。

二、核心电性能参数解析

1. 频率与精度指标

  • 核心频率:8MHz,属于电子设备中常用的中低频时钟基准,适配多数MCU(如STM32、ATmega系列)、通信接口(UART、SPI、I2C)的时钟需求,无需额外复杂的分频/倍频电路,简化系统设计。
  • 常温频差:±20ppm(25℃环境下),即频率偏差≤160Hz(8MHz×20×10⁻⁶),满足消费电子、工业控制等场景对时钟精度的基本要求,避免因频率偏差导致的通信丢包、指令执行时序误差。
  • 频率稳定度:±30ppm(-40℃~+85℃全温区),即温度变化时频率漂移≤240Hz,该稳定度可覆盖工业级设备的温度波动范围,确保极端环境下(如北方冬季户外、南方夏季高温车间)仍能稳定输出时钟信号。

2. 负载与阻抗特性

  • 负载电容:18pF,需匹配外部电容(通常为两个9pF陶瓷电容并联,需考虑PCB寄生电容),确保晶振振荡回路达到最优匹配,避免因负载不匹配导致的频率偏移或停振。
  • 等效串联电阻(ESR):80Ω,属于常规贴片晶振的ESR水平,在振荡电路中可保证足够的增益裕量,降低因ESR过高导致的停振风险,同时避免功耗过大影响系统续航。

三、工作环境适应性

TX50328M2KDCE1T的工作温度范围为**-40℃~+85℃**,覆盖了工业级设备的典型温度需求,可稳定应用于:

  • 户外传感器节点(如农业物联网的土壤湿度传感器、工业现场的温度采集模块);
  • 工业控制核心设备(PLC、电机驱动器、伺服控制器);
  • 车载周边设备(行车记录仪、车载充电器的控制单元、胎压监测模块)。

此外,产品通过了行业标准的振动(10~2000Hz,1.5g)、冲击(1000g,0.5ms)测试,可承受运输过程中的机械应力,减少现场失效概率。

四、典型应用场景

1. 工业控制领域

  • PLC(可编程逻辑控制器):为数字量输入输出、Modbus通信模块提供稳定时钟,确保指令执行时序准确,避免因时钟漂移导致的设备误动作;
  • 传感器节点:如压力、流量传感器的信号采集模块,8MHz频率适配ADC采样时钟,保证数据采集精度。

2. 消费电子领域

  • 智能家居设备:智能开关、智能门锁的控制MCU时钟,满足低功耗与精度需求,避免因时钟不稳定导致的远程控制延迟;
  • 蓝牙低功耗(BLE)模块:作为BLE通信的基准时钟,确保数据传输的稳定性,适配蓝牙4.0/5.0协议的时序要求。

3. 车载周边设备

  • 行车记录仪:辅助控制单元的时钟基准,适应车载环境的温度波动(-20℃~+70℃),保证视频录制与存储的连续性;
  • 车载USB充电器:MCU的时钟信号,实现QC/PD快充协议的准确识别,避免因时钟偏差导致的充电协议握手失败。

五、品牌与可靠性说明

雅晶鑫(YJX)是国内专注于石英晶振研发、生产的品牌,TX50328M2KDCE1T经过批量一致性测试,确保同批次产品参数偏差极小(频率偏差一致性≤5ppm),适合量产项目的物料选型;同时,产品提供1年以上的质保周期,降低客户的售后风险。

总结:TX50328M2KDCE1T以小尺寸、稳定的8MHz时钟输出、宽温适应性为核心优势,是工业控制、消费电子等领域中低成本、高可靠性时钟方案的优选之一,可满足多数中低端电子设备的时钟需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.