Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TXM20M0002503LFBEO00T是雅晶鑫(YJX)品牌推出的工业级无源贴片晶振,采用SMD5032封装(2引脚),以20MHz为标称频率,专为中低端数字电路的时钟基准需求设计,兼顾精度、体积与成本,适用于消费电子、工业控制、物联网等多领域。
该型号属于无源晶振范畴(无内置振荡驱动电路,需外接匹配电路),核心识别信息如下:
产品参数直接决定应用适配性,以下为关键参数的意义与实际价值:
标称频率为20MHz,是当前数字电路中常见的中低频时钟基准(如8位/32位MCU、BLE模块等多以此为默认时钟),无需额外分频即可满足多数处理器的时钟输入需求。
20pF为晶振工作时需外接的匹配电容总和(通常在晶振两端各接10pF电容到地),若负载电容不匹配,会导致振荡频率偏移、启动困难甚至无法振荡,需严格按规格选择外接电容。
30Ω为晶振自身的串联电阻,ESR越小,振荡电路的启动速度越快、稳定性越高(不易受干扰)。30Ω属于SMD5032封装无源晶振的典型优良值,可降低振荡电路的设计难度。
**-20℃~+70℃**为标准工业级温度范围,覆盖了室内环境、一般户外非极端场景(如仓库、小型车间),无需额外温控措施即可稳定工作。
SMD5032(尺寸约5.0mm×3.2mm×1.2mm)为小型化贴片封装,2引脚设计兼容主流SMT设备,适合批量自动化生产,且可有效节省PCB空间(适用于便携式设备、小型模块)。
该产品在同类产品中具备以下核心优势:
TXM20M0002503LFBEO00T的参数特性使其适用于以下场景:
为确保晶振稳定工作,需注意以下几点:
TXM20M0002503LFBEO00T是一款高性价比的工业级无源贴片晶振,以20MHz为核心频率,兼顾精度、体积与可靠性,适用于多数中低端数字电路的时钟基准需求,是消费电子、工业控制、物联网等领域的实用选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products