WMSIC Electronic Components

TX50328M2LBCE1T

ModelTX50328M2LBCE1T
PackageSMD5032
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TX50328M2LBCE1T
Type
YJX
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TX50328M2LBCE1T
Electronic Component
1
Package
SMD5032
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.14g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264594687
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TX50328M2LBCE1T 贴片晶振产品概述

一、产品定位与核心身份

TX50328M2LBCE1T是雅晶鑫(YJX)推出的工业级通用贴片石英晶振,聚焦中低端电子设备的频率基准需求,兼顾成本控制与性能稳定性。型号命名中,“5032”对应封装尺寸(5.0×3.2×1.2mm),“8M”明确标称频率,“LBCE1T”关联负载电容、频差等关键参数配置,是国内市场主流的入门级工业晶振之一。

二、关键性能参数解析

该晶振的核心参数覆盖频率精度、稳定性、匹配性等核心指标,具体可从实际应用角度解读:

  1. 频率精度:标称8MHz,常温(25℃)频差±10ppm——即实际输出与标称值偏差不超过80Hz,能满足绝大多数数字电路(如单片机、PLC)的频率需求;
  2. 温度稳定性:-40℃~+85℃全温范围内,频率漂移±30ppm——意味着温度变化时,频率波动不超过240Hz,可避免设备在极端环境下出现通信丢包、控制精度下降;
  3. 负载电容:默认20pF——设计电路时需严格匹配该值(外围电容偏差需控制在±5%内),否则会导致频率偏移超出允许范围;
  4. 等效串联电阻(ESR):典型80Ω——属于石英晶振常规水平,既保证起振可靠性,又不会因电阻过高增加电路功耗;
  5. 工作温度:-40℃~+85℃——覆盖工业级环境,可适应户外、车间等复杂场景,无需额外散热/保温。

三、封装设计与工艺特性

采用SMD5032陶瓷贴片封装,具备以下实用优势:

  • 小体积高密度:5.0×3.2×1.2mm尺寸,适合智能门锁、便携医疗仪器等小型化设备;
  • 自动化兼容:标准SMD引脚布局,可通过贴片机快速焊接,降低生产人工成本;
  • 抗干扰防潮:陶瓷封装隔离电磁干扰,同时防潮性能优异,延长产品寿命;
  • 机械强度:封装硬度高,可承受轻微振动/冲击,适合车载辅助设备(如行车记录仪)等场景。

四、环境适应性与可靠性

作为工业级晶振,其可靠性体现在:

  • 宽温稳定:-40℃~+85℃无性能衰减,冬季低温、夏季高温下仍能稳定工作;
  • 起振可靠:80Ω ESR配合合理电路设计,可快速起振且无停振风险;
  • 长寿命:优质石英晶体+陶瓷封装,平均无故障时间(MTBF)达5万小时以上,满足设备长期运行需求;
  • 抗老化:经老化测试后,频率漂移控制在±5ppm内,避免设备后期出现频率偏移。

五、典型应用场景

因成本可控、性能均衡,该晶振广泛应用于:

  1. 工业控制:PLC模块、传感器节点、小型变频器;
  2. 消费电子:智能家居(智能门锁、温湿度传感器)、小型家电(智能电饭煲、加湿器);
  3. 通信设备:蓝牙4.0模块、ZigBee网关、小型路由器;
  4. 医疗电子:电子体温计、血糖仪、小型监护仪;
  5. 车载辅助:车载USB充电器、行车记录仪辅助电路(非核心安全部件)。

六、选型与应用注意事项

为确保性能最大化,需注意:

  1. 负载电容匹配:必须用20pF电容(并联/串联需按电路设计计算),偏差超5%会导致频率偏移;
  2. 焊接温度:回流焊峰值温度≤260℃,焊接时间≤10秒,避免高温损坏晶体;
  3. 干扰隔离:远离高频电路、电源模块,可通过接地/屏蔽减少频率偏移;
  4. ESR匹配:振荡电路增益需大于1/ESR(即≥12.5mS),避免起振困难。

该产品以高性价比、稳定可靠的特点,成为通用电子设备晶振选型的主流选择之一,尤其适合对成本敏感但需工业级温度适应性的场景。

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