WMSIC Electronic Components

T49S25MLDBE2X

ModelT49S25MLDBE2X
PackageHC-49S
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX T49S25MLDBE2X
Type
YJX
Minimum package
200 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
T49S25MLDBE2X
Electronic Component
1
Package
HC-49S
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.539g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0264981808
Operating Temperature
20℃~+70℃
Electronic Component
±20ppm
Crystal Oscillator Type
Through-hole Crystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

T49S25MLDBE2X 产品概述

一、产品简介

T49S25MLDBE2X 為全国产直插晶振,品牌:YJX(雅晶鑫),封装为 HC-49S(插件式)。标称频率 25.000 MHz,适用于需要稳定参考时钟的各类电子设备。产品工艺成熟,适配常见直插安装与标准插座,便于工程样机验证与小批量生产。

二、主要性能特点

  • 常温初始频差:±20 ppm,出厂一致性高,免长期调校。
  • 频率稳定度(含温度与老化):±30 ppm,能满足中高精度时钟要求。
  • 负载电容:20 pF(建议按设计匹配负载网络)。
  • 等效串联电阻(ESR):40 Ω,适配多数振荡电路输入阻抗。
  • 工作温度范围:-20 ℃ ~ +70 ℃,适合民用与工业低端温度环境。

三、电气与机械参数(关键值)

  • 频率:25.000 MHz
  • 初始频差:±20 ppm
  • 频率稳定度:±30 ppm
  • 负载电容:20 pF
  • ESR:40 Ω(典型)
  • 工作温度:-20℃~+70℃
  • 封装:HC-49S(插件/直插)

四、封装与安装

HC-49S 直插封装,便于手工焊接与波峰焊(推荐按公司工艺规范进行)。封装兼容市面常见 HC-49S 插座与 PCB 孔径布局,适合样机调试及批量装配。

五、典型应用

  • 单片机/微控制器时钟源
  • 通信设备与网络同步参考
  • 数字测量仪器、计时设备
  • 消费电子、工业控制模块

六、使用与注意事项

  • 为保证频率精度,PCB 布局应尽量缩短晶振引脚到耦合电容与输入引脚的走线,避免与高频信号线平行长距。
  • 负载电容请按规格(20 pF)配置并考虑 PCB 寄生电容的影响。
  • 在极端温度或高振动环境下使用前,建议进行可靠性验证。
  • 焊接时遵循通用焊接曲线与热冲击限制,避免长时间超温。

七、订购信息

型号:T49S25MLDBE2X,品牌:YJX(雅晶鑫),封装:HC-49S,频率:25 MHz。如需样品或批量报价,请提供数量、交付期与用途,以便获取更详细的出货与测试参数。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.