WMSIC Electronic Components

TX50328M4LDCE2T

ModelTX50328M4LDCE2T
PackageSMD5032-4P
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TX50328M4LDCE2T
Type
YJX
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TX50328M4LDCE2T
Electronic Component
1
Package
SMD5032-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.11g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264498430
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TX50328M4LDCE2T 贴片晶振产品概述

TX50328M4LDCE2T是雅晶鑫(YJX)品牌推出的一款SMD5032-4P封装贴片石英晶振,专为工业控制、消费电子、低速率通信等场景设计,兼顾宽温适应性与稳定的频率输出性能,是多数中精度频率源应用的可靠选择。

一、产品基本定位与规格标识

该型号遵循雅晶鑫常规系列命名逻辑,核心信息清晰:

  • TX5032:代表封装尺寸为5.0×3.2mm(SMD5032标准封装);
  • 8M:核心输出频率为8MHz(适配多数微控制器、无线模块的时钟需求);
  • LDCE2T:系列参数标识,对应负载电容、频率稳定度等具体配置;
  • 品牌:雅晶鑫(YJX),国内专注石英晶振研发生产的厂商,产品覆盖消费级到工业级全场景。

二、核心性能参数详解

2.1 频率与频差

  • 标称频率:8MHz(中低频段,广泛适配MCU、BLE模块等核心器件);
  • 常温频差:±20ppm(25℃环境下,频率偏差≤160Hz,满足工业数据采集、消费电子的精度要求)。

2.2 负载电容与振荡匹配

  • 标准负载电容:20pF(电路需确保总负载电容=电路负载电容+寄生电容≈20pF,若匹配不当会导致频率偏移或振荡失效);
  • 适配CMOS/TTL振荡电路,无需额外复杂阻抗匹配。

2.3 等效串联电阻(ESR)

  • ESR值:80Ω(工业级晶振合理范围,低ESR降低振荡功耗,同时适配多数MCU内置振荡电路的驱动能力)。

2.4 频率稳定度

  • 综合稳定度:±30ppm(涵盖温度、电源波动、机械应力等因素,全温范围内频率偏差≤240Hz,满足宽温环境稳定运行)。

三、封装形式与典型应用场景

3.1 封装特点

  • 封装类型:SMD5032-4P(贴片4引脚,无引线封装);
  • 尺寸:5.0mm×3.2mm×1.2mm(常规厚度),支持高密度PCB设计,兼容自动化贴装(回流焊/波峰焊);
  • 引脚定义:需参考官方datasheet,典型为振荡输入(IN)、输出(OUT)、接地(GND)、电源(VCC)。

3.2 典型应用场景

  1. 工业控制:智能电表、PLC模块、户外传感器节点(-40℃~+85℃宽温适配车间/户外环境);
  2. 消费电子:智能家居设备(智能开关、温湿度传感器)、小型家电控制器(加湿器、空气净化器);
  3. 通信周边:BLE模块、ZigBee节点、低速率LoRa模块(8MHz适配多数无线芯片时钟);
  4. 车载辅助:胎压监测传感器、车载蓝牙适配器(宽温满足车载环境温度变化)。

四、环境适应性与可靠性保障

  • 宽温工作:-40℃~+85℃(符合工业级要求,应对低温存储、高温运行场景);
  • 环保认证:符合RoHS 2.0、REACH标准,无铅焊接兼容;
  • 品牌可靠性:采用成熟晶体加工工艺,经老化测试筛选,MTBF≥10^6小时,降低应用故障风险。

五、选型与应用注意事项

  1. 负载电容匹配:PCB寄生电容通常25pF,实际电路负载电容需设为1518pF(总负载≈20pF);
  2. 振荡驱动:确保MCU内置振荡电路增益≥2×ESR(160Ω),防止停振;
  3. 贴装工艺:焊接温度≤260℃(回流焊峰值),时间≤10秒,避免机械应力导致晶体破裂;
  4. 存储条件:未焊接产品存于0℃35℃、湿度30%70%环境,避免高湿暴露。

该产品以稳定性能、紧凑封装和宽温适应性,成为中精度频率源应用的高性价比选择,可直接替代同类SMD5032封装的8MHz晶振。

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