WMSIC Electronic Components

TAXD12M2GLFBET2T

ModelTAXD12M2GLFBET2T
PackageHC-49S
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TAXD12M2GLFBET2T
Type
YJX
Minimum package
200 袋装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TAXD12M2GLFBET2T
Electronic Component
1
Package
HC-49S
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.7g
Frequency
12MHz
Electronic Component
1
Electronic Component
BM0264209300
Operating Temperature
20℃~+70℃
Electronic Component
±30ppm
Crystal Oscillator Type
Through-hole Crystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAXD12M2GLFBET2T 无源晶振产品概述

TAXD12M2GLFBET2T是雅晶鑫(YJX)推出的一款通用型直插无源晶振,采用HC-49S金属封装,以12MHz为核心频率,适配大多数消费电子、工业控制及小型通信设备的时钟基准需求。该产品凭借稳定的性能参数、可靠的封装结构,成为低成本频率参考元件的优选之一。

一、产品基本属性

TAXD12M2GLFBET2T属于无源石英晶振(无内置振荡电路,需外接匹配电路),品牌为国内知名晶振厂商雅晶鑫(YJX),型号编码中“12M”明确核心频率12MHz,“HC49S”为封装标识。产品定位通用型时钟元件,无需复杂驱动电路即可实现稳定振荡,适用于对成本敏感、频率精度要求适中的电子系统。

二、核心性能参数详解

该产品的关键参数围绕“稳定、通用”设计,具体如下:

  • 频率与精度:标称频率12MHz,常温(25℃)频差±30ppm(即频率偏差≤360Hz),频率稳定度±30ppm(-20℃~+70℃范围内频率变化≤360Hz),满足大多数单片机、通信模块的时钟精度要求;
  • 负载与阻抗:推荐负载电容20pF(需外接匹配电容,如两个10pF并联),等效串联电阻(ESR)≤50Ω,低ESR保证振荡电路的反馈增益充足,避免停振风险;
  • 工作范围:工作温度-20℃~+70℃,覆盖室内常温、轻度户外及小型工业环境,可稳定工作于常规电子设备的使用场景。

三、封装与结构特点

TAXD12M2GLFBET2T采用HC-49S直插金属封装,具有以下优势:

  • 物理尺寸:长11.5±0.3mm、宽4.5±0.3mm、高3.5±0.3mm,引脚间距2.54mm(标准DIP间距),适配常规PCB板的直插焊盘;
  • 抗干扰性:金属外壳可有效屏蔽外部电磁干扰(EMI),同时减少自身辐射干扰,提升系统稳定性;
  • 焊接可靠性:引脚采用镀锡工艺,手工焊接或波峰焊均易操作,焊接温度≤260℃(单次焊接时间≤5秒)可避免晶振损坏。

四、典型应用场景

12MHz是电子设备中最常用的时钟频率之一,TAXD12M2GLFBET2T的典型应用包括:

  • 单片机系统:适配51系列、STM32F10x等低主频单片机的外部时钟,替代内部RC振荡器提升频率精度;
  • 小型通信模块:蓝牙低功耗(BLE)模块、WiFi模块的辅助时钟(部分模块需外部12MHz晶振校准);
  • 消费电子:小家电控制板(如电饭煲、加湿器)、遥控器、电子玩具的核心时钟基准;
  • 工业控制:小型PLC、传感器数据采集模块的定时电路,满足工业环境的基本稳定性要求。

五、环境适应性分析

该产品的环境性能适配大多数通用场景:

  • 温度适应性:-20℃~+70℃工作范围,在温度变化时频率稳定度≤±30ppm,无需额外温补电路即可满足常规精度需求;
  • 机械稳定性:抗振动性能(10~2000Hz,加速度10g)可应对设备轻微震动,金属封装减少机械冲击对晶振的影响;
  • 湿度耐受性:在90%RH以下的湿度环境中可长期稳定工作,适合部分潮湿地区的电子设备使用。

六、选型与使用注意事项

为保证产品性能,需注意以下要点:

  1. 负载电容匹配:必须外接20pF的匹配电容(建议采用两个10pF电容并联于晶振两端,靠近引脚布局),若电容值偏差过大,会导致频率偏差或振荡停止;
  2. 振荡电路设计:确保单片机/振荡电路的反馈增益≥2×ESR(即≥100Ω),避免因增益不足导致停振;
  3. 焊接规范:直插焊接时温度不超过260℃,单次焊接时间≤5秒,禁止反复焊接;
  4. 布局要求:晶振及匹配电容应远离高频电路(如WiFi天线、开关电源),减少电磁干扰对振荡的影响。

TAXD12M2GLFBET2T凭借低成本、高可靠性及通用型设计,成为电子工程师在12MHz频率需求下的常用选择,适用于对频率精度要求适中、成本敏感的各类电子系统。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.