WMSIC Electronic Components

TX50328M2LDCE1T

ModelTX50328M2LDCE1T
PackageSMD5032
BrandYJX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YJX TX50328M2LDCE1T
Type
YJX
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YJX
Electronic Component
TX50328M2LDCE1T
Electronic Component
1
Package
SMD5032
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.13g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0264468408
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TX50328M2LDCE1T 8MHz贴片晶振产品概述

TX50328M2LDCE1T是雅晶鑫(YJX)推出的工业级SMD5032封装8MHz石英贴片晶振,针对通用电子设备的时钟基准需求设计,兼顾体积小型化、频率稳定性与环境适应性,适用于工业控制、消费电子、通信终端等多领域场景。

一、产品基本属性定位

该晶振采用SMD5032标准贴片封装(尺寸5.0×3.2×1.2mm),属于小型化表面贴装元件,适配自动化贴片生产;核心为石英晶体谐振器,通过压电效应实现稳定的8MHz频率输出,是各类数字电路(MCU、FPGA、通信IC等)的核心时钟源,替代传统插件晶振提升设备集成度,降低生产工艺复杂度。

二、核心性能参数解析

1. 频率精度与稳定度

  • 常温频差±20ppm:在25℃环境下,实际频率与标称8MHz的偏差控制在±160Hz内,满足多数电子设备的定时精度要求(如单片机指令周期的一致性、通信协议的时序匹配);
  • 全温区频率稳定度±30ppm:覆盖-40℃~+85℃工作温区时,频率漂移最大为±240Hz,优于普通消费级晶振(一般±50ppm),可稳定适配工业环境的温度变化(如车间冬夏温差、户外设备极端温度)。

2. 起振与匹配参数

  • 负载电容20pF:晶振工作需外部并联匹配电容(通常两端各接10pF陶瓷电容到地),该参数与多数MCU、通信IC的晶振输入端口原生匹配,无需额外调整电路参数;
  • 等效串联电阻(ESR)80Ω:ESR是晶振起振的关键指标,80Ω属于该封装下的低阻水平,可确保与主流芯片的起振电路兼容(一般要求ESR<100Ω即可稳定起振),同时降低晶振自身功耗(约0.1mW左右)。

三、典型应用场景

该晶振的性能与封装特点使其覆盖多领域实用场景:

1. 工业控制设备

如PLC可编程逻辑控制器、传感器数据采集模块、工业机器人关节控制器——温区覆盖-40℃~+85℃,可适应车间高低温环境,频率稳定度满足设备定时指令的可靠性(如PLC周期扫描、传感器采样同步);

2. 消费电子终端

智能家电(空调、洗衣机控制器)、机顶盒、路由器——SMD5032封装体积小,适合设备小型化设计,8MHz频率匹配多数MCU的时钟需求(如STM32系列、ATmega系列单片机);

3. 低功耗通信模块

蓝牙5.0模块、WiFi 6E模块、物联网(IoT)终端——8MHz是通信芯片的常用参考频率,负载电容20pF与模块IC完美匹配,ESR低阻特性降低模块整体功耗(尤其适合电池供电的IoT设备);

4. 车载后装设备

行车记录仪、车载音响、车载导航——温区覆盖车载环境(-20℃~+70℃),可靠性满足后装设备的使用需求(注:若需车规级认证需确认雅晶鑫对应车规型号)。

四、可靠性与环境适应性

1. 温湿度耐受性

工作温度-40℃+85℃,存储温度-55℃+125℃,可应对极端环境(如北方冬季户外设备、南方夏季高温车间);湿度范围0~95%RH(无凝露),避免潮湿环境对晶振性能的影响;

2. 封装可靠性

SMD5032无引脚封装,焊接兼容性强,支持回流焊、波峰焊(需注意焊接温度曲线),抗振动性能优于插件晶振,可承受10g~20g的振动环境(符合IEC 60068-2-6振动测试标准);

3. 寿命与一致性

石英晶体固有寿命长(标称10万小时以上),雅晶鑫生产工艺成熟,批量产品频率一致性好(批量频差控制在±15ppm内),避免设备批量生产中的兼容性问题。

五、应用设计注意事项

1. 负载电容匹配

必须严格按照20pF负载电容设计,电路中晶振XTAL1/XTAL2引脚各接10pF陶瓷电容到地(可预留1pF可调电容微调),避免负载电容不符导致不起振或频率漂移(如负载电容过小会导致频率偏高,过大则起振困难);

2. 布局与干扰防护

晶振应尽量靠近MCU的XTAL引脚,走线长度不超过2cm,避免与高频信号线(如SPI、USB)平行;晶振下方建议铺地,减少电磁干扰(EMI)对时钟信号的影响;

3. 焊接工艺控制

回流焊峰值温度控制在230℃~240℃,时间不超过10秒;波峰焊温度不超过220℃,避免过热损坏晶振内部石英晶体(若焊接温度过高会导致晶体老化加速);

4. 测试验证

实际应用中可通过示波器观察晶振输出波形(峰峰值应>0.5V),确认起振稳定;若需高精度应用,可通过频率计检测全温区频率漂移(如-40℃时漂移是否在±30ppm内)。

TX50328M2LDCE1T凭借小型化封装、稳定的频率性能与工业级温区覆盖,成为通用电子设备时钟基准的高性价比选择,可满足多数场景下的时钟需求,是中小批量设备开发与生产的理想元件。

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