Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TX50328M2LDCE1T是雅晶鑫(YJX)推出的工业级SMD5032封装8MHz石英贴片晶振,针对通用电子设备的时钟基准需求设计,兼顾体积小型化、频率稳定性与环境适应性,适用于工业控制、消费电子、通信终端等多领域场景。
该晶振采用SMD5032标准贴片封装(尺寸5.0×3.2×1.2mm),属于小型化表面贴装元件,适配自动化贴片生产;核心为石英晶体谐振器,通过压电效应实现稳定的8MHz频率输出,是各类数字电路(MCU、FPGA、通信IC等)的核心时钟源,替代传统插件晶振提升设备集成度,降低生产工艺复杂度。
该晶振的性能与封装特点使其覆盖多领域实用场景:
如PLC可编程逻辑控制器、传感器数据采集模块、工业机器人关节控制器——温区覆盖-40℃~+85℃,可适应车间高低温环境,频率稳定度满足设备定时指令的可靠性(如PLC周期扫描、传感器采样同步);
智能家电(空调、洗衣机控制器)、机顶盒、路由器——SMD5032封装体积小,适合设备小型化设计,8MHz频率匹配多数MCU的时钟需求(如STM32系列、ATmega系列单片机);
蓝牙5.0模块、WiFi 6E模块、物联网(IoT)终端——8MHz是通信芯片的常用参考频率,负载电容20pF与模块IC完美匹配,ESR低阻特性降低模块整体功耗(尤其适合电池供电的IoT设备);
行车记录仪、车载音响、车载导航——温区覆盖车载环境(-20℃~+70℃),可靠性满足后装设备的使用需求(注:若需车规级认证需确认雅晶鑫对应车规型号)。
工作温度-40℃+85℃,存储温度-55℃+125℃,可应对极端环境(如北方冬季户外设备、南方夏季高温车间);湿度范围0~95%RH(无凝露),避免潮湿环境对晶振性能的影响;
SMD5032无引脚封装,焊接兼容性强,支持回流焊、波峰焊(需注意焊接温度曲线),抗振动性能优于插件晶振,可承受10g~20g的振动环境(符合IEC 60068-2-6振动测试标准);
石英晶体固有寿命长(标称10万小时以上),雅晶鑫生产工艺成熟,批量产品频率一致性好(批量频差控制在±15ppm内),避免设备批量生产中的兼容性问题。
必须严格按照20pF负载电容设计,电路中晶振XTAL1/XTAL2引脚各接10pF陶瓷电容到地(可预留1pF可调电容微调),避免负载电容不符导致不起振或频率漂移(如负载电容过小会导致频率偏高,过大则起振困难);
晶振应尽量靠近MCU的XTAL引脚,走线长度不超过2cm,避免与高频信号线(如SPI、USB)平行;晶振下方建议铺地,减少电磁干扰(EMI)对时钟信号的影响;
回流焊峰值温度控制在230℃~240℃,时间不超过10秒;波峰焊温度不超过220℃,避免过热损坏晶振内部石英晶体(若焊接温度过高会导致晶体老化加速);
实际应用中可通过示波器观察晶振输出波形(峰峰值应>0.5V),确认起振稳定;若需高精度应用,可通过频率计检测全温区频率漂移(如-40℃时漂移是否在±30ppm内)。
TX50328M2LDCE1T凭借小型化封装、稳定的频率性能与工业级温区覆盖,成为通用电子设备时钟基准的高性价比选择,可满足多数场景下的时钟需求,是中小批量设备开发与生产的理想元件。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products