Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YANGJIE BAT54WS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- YANGJIE BAT54WS
- Type
- SOD-323(SC-90)
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- BAT54WS
- Electronic Component
- 1
- Package
- SOD-323(SC-90)
- Electronic Component
- 0.029g
- Electronic Component
- 1
- Electronic Component
- BM0229463320
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54WS 产品概述
一、产品简介
BAT54WS 系列为小功率肖特基二极管，品牌：YANGJIE（扬杰）。器件采用 SOD-323 小封装，体积微小，适合空间受限的便携式和消费类电子产品。器件以低正向压降和快速恢复特性为主要卖点，适用于低压快速整流与保护电路。
二、主要电气参数
- 正向压降（Vf）：1.0 V @ IF = 100 mA
- 直流反向耐压（VR）：30 V
- 最大整流电流（IF）：200 mA（直流）
- 反向漏电流（IR）：2 μA @ VR = 25 V（Ta=25℃）
- 非重复峰值浪涌电流（Ifsm）：600 mA（一次性脉冲）
- 工作结温范围：-55 ～ +125 ℃
三、主要特性与优势
- 低正向压降：在 100 mA 工作点时典型 Vf 为 1 V，可降低整流损耗与功耗，适合低电压电源回路。
- 低反向漏流：25 V 时 IR 仅 2 μA，适合对漏电控要求高的待机电路与电池供电设备。
- 快速响应、良好浪涌承受能力：Ifsm 可达 600 mA，能承受短时浪涌电流，提升保护能力。
- 小型封装：SOD-323 占板面积小，利于高密度 PCB 布局与轻薄化设计。
四、典型应用场合
- 低压整流、二极管保护与极性反接保护
- 电源管理、电池充放电路径保护与电源切换
- 检波、限幅与高速切换电路
- 移动设备、蓝牙、便携式仪表、物联网终端等空间受限、功耗敏感场合
五、封装与可靠性注意事项
SOD-323 为表面贴装封装，推荐采用标准回流焊工艺进行贴装，注意焊盘设计与热沉管理以避免长期高温造成结温升高。器件最大工作结温为 +125 ℃，在高温或高电流工况下应适当降额使用并检查散热条件。反向耐压为 30 V，超出该电压可能导致击穿与损坏。
六、选型与使用建议
- 设计时根据实际工作电流和环境温度对 Vf 和功耗进行热分析，必要时留有安全余量。
- 若需要更高电流或更高耐压，可考虑更大封装或不同型号替代；若对漏电流或 Vf 有更严格要求，可比较其他肖特基型号参数后选型。
- SOD-323 封装便于自动化贴装与小批量装配，订购时留意包装方式（卷带/盘装）以匹配生产需求。
如需器件管脚、典型电路图或回流焊曲线等详细资料，可进一步提供 PCB 应用场景与工作点，以便给出更具体的布板与热管理建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
