WMSIC Electronic Components

YANGJIE ESDSLC5V0LB

ModelESDSLC5V0LB
PackageDFN1006-2L
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE ESDSLC5V0LB
Type
DFN1006-2L
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
ESDSLC5V0LB
Electronic Component
1
Package
DFN1006-2L
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0228719290
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESDSLC5V0LB 产品概述

ESDSLC5V0LB 是扬杰(YANGJIE)推出的一款高性能双向 ESD/浪涌保护器件,采用小尺寸 DFN1006-2(SOD-882)封装,专为高速信号线与低电压电源线的瞬态过压保护设计。器件在体积极小的前提下提供可靠的击穿与钳位能力,适合移动终端、消费电子、工业通信模块等对体积、速度和可靠性均有较高要求的应用场景。

一、关键参数一览

  • 产品型号:ESDSLC5V0LB
  • 品牌:YANGJIE(扬杰)
  • 极性:双向(Bidirectional)
  • 额定反向截止电压 Vrwm:5 V
  • 击穿电压:8 V(典型)
  • 钳位电压:11 V(典型,Ipp 条件下)
  • 峰值脉冲电流 Ipp:7 A @ 8/20 μs
  • 峰值脉冲功率 Ppp:77 W @ 8/20 μs
  • 反向电流 Ir:5 nA(静态低漏)
  • 结电容 Cj:0.8 pF(低电容)
  • 通道数:单路
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:DFN1006-2 (SOD-882)
  • 防护等级:满足 IEC 61000-4-5(浪涌)与 IEC 61000-4-2(静电放电)标准

二、主要特性与优势

  • 低电容:0.8 pF 的结电容使得器件对高速信号(如 USB、HDMI、MIPI、LVDS 等)引入的失真极小,适合对信号完整性要求高的接口保护。
  • 双向结构:在正负瞬态冲击下均能工作,无需额外极性识别,适合数据线和差分信号保护。
  • 良好的钳位性能:典型钳位电压 11 V(在 Ipp 条件下)可将瞬态电压有效限制到器件耐受范围内,保护后端敏感器件。
  • 高能量吸收能力:支持 7 A @ 8/20 μs 的脉冲电流,峰值功率 77 W,足以应对常见的雷击浪涌和工业脉冲干扰。
  • 超低漏电流:5 nA 的漏电特性有利于低功耗系统与待机电路,避免对信号及电源线造成静态影响。
  • 小型化封装:DFN1006-2(SOD-882)占板面积小,便于在空间受限的设计中贴近接口布置,降低走线寄生。

三、典型应用场景

  • 手机、平板等移动终端的 USB/充电口保护
  • 摄像头模块、图像传感器与 MIPI 接口的过压保护
  • HDMI、DisplayPort、LVDS 等高速视频接口保护
  • 工业与消费类通信接口(以太网 PHY 辅助保护)
  • IoT 终端、可穿戴设备、智能家居接口防护

四、PCB 布局与使用建议

  • 就近放置:将 ESDSLC5V0LB 靠近需要保护的连接器或接口放置,可将未保护走线长度降到最低,提升保护效果。
  • 短回流路径:保护器到地的回流路径应尽量短、宽,优先使用完整的地平面来降低回流感抗。
  • 严格限制峰值电流:设计时应避免超过器件标称的 Ipp 与 Ppp 参数,必要时可考虑在前端串联抗冲击元件或并联多个保护器分担能量。
  • 温度与热量管理:虽然器件耐温范围为 -40 ℃ ~ +85 ℃,在高能量冲击频繁的场合应考虑散热与热循环影响,避免长期在边界温度工作。
  • 焊接工艺:推荐按照常规 SMT 回流工艺进行贴片焊接,注意 ESD 操作规程以防安装时损坏器件。

五、可靠性与合规

ESDSLC5V0LB 符合 IEC 61000-4-2(静电放电)与 IEC 61000-4-5(雷击/浪涌)规范要求,器件在设计上兼顾了高速信号完整性与抗瞬态能量能力,适合通过常见的系统级 EMC 测试。其低漏电和小封装特点使其在消费类电子及嵌入式系统中具备较高的适配性。

总结:ESDSLC5V0LB 以双向保护、低电容与小型化封装为核心优势,在对高速信号完整性与瞬态防护有严格要求的场合,是一款平衡性能与体积的可靠选择。选型时请结合系统最大允许电压、预期冲击能量以及工作环境温度等因素进行综合评估。

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