WMSIC Electronic Components

YANGJIE ESD3V3LB

ModelESD3V3LB
PackageDFN1006-2L
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YANGJIE ESD3V3LB
Type
DFN1006-2L
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
ESD3V3LB
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.011g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
13pF
Electronic Component
BM0264525729
Voltage
10V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

扬杰ESD3V3LB 双向TVS静电防护器件产品概述

一、产品定位与核心作用

ESD3V3LB是扬杰科技推出的低电压双向瞬态抑制二极管(TVS),专为3.3V供电的电子系统设计,核心作用是快速抑制静电放电(ESD)、电快速瞬变脉冲群(EFT)、浪涌(Surge) 三类瞬态干扰,避免MCU、传感器、通信芯片等敏感元件因过压损坏,提升设备可靠性与稳定性。

二、关键电气参数解析

该器件的参数针对3.3V系统做了精准优化,核心指标如下:

1. 电压与电流核心指标

  • 反向截止电压(Vrwm)3.3V:与主流3.3V电源轨完全匹配,正常工作时器件处于截止状态,不影响电路供电;
  • 击穿电压(Vbr)4V:比截止电压高0.7V,确保正常工作无导通漏电流,仅在瞬态过压超过4V时快速响应;
  • 钳位电压(Vc)10V:遭遇脉冲干扰时,将电压钳位在10V以内(远低于多数敏感芯片15V以下的最大耐压),直接保护后端电路;
  • 峰值脉冲电流(Ipp)9A@8/20us:支持8/20us标准浪涌波形下9A峰值电流冲击,可应对多次静电/浪涌干扰而不失效;
  • 峰值脉冲功率(Ppp)90W:由Vc×Ipp计算得出(10V×9A),反映器件脉冲功率耐受能力,满足消费电子与工业低电压场景需求。

2. 其他关键参数

  • 反向漏电流(Ir)100nA:极低漏电流,避免影响便携设备电池续航;
  • 结电容(Cj)13pF:适中电容值,既保证防护效果,又不过度干扰I2C、SPI等中速信号传输;
  • 通道数:单路设计,结构简单,易集成到单电源轨或单信号线。

三、全面的防护能力覆盖

ESD3V3LB符合IEC 61000-4系列国际标准,可应对三类常见干扰:

  • 静电放电(IEC 61000-4-2):支持接触放电±8kV、空气放电±15kV,覆盖人体触摸、设备插拔等场景;
  • 电快速瞬变脉冲群(IEC 61000-4-4):抑制±2kV/5kHz快速脉冲,应对开关切换、电机启停的瞬变噪声;
  • 浪涌(IEC 61000-4-5):耐受±2kV/2Ω浪涌,防护雷电感应、电源波动等大能量干扰。

四、封装与典型应用场景

1. 封装特点

采用DFN1006-2L封装:尺寸仅1.0mm×0.6mm×0.4mm(典型值),2引脚无引脚框架设计,降低寄生电感,响应速度更快;表面贴装工艺适配自动化批量生产,满足小型化设备空间需求。

2. 典型应用

  • 消费电子:智能手机、平板的USB/音频接口,智能手表的传感器接口防护;
  • 可穿戴设备:手环、蓝牙耳机的充电口、蓝牙/WiFi模块防护;
  • 物联网(IoT):低功耗MCU、温湿度/运动传感器节点的电源与信号防护;
  • 工业控制:PLC、远程IO模块的3.3V电源轨、数字IO接口防护;
  • 汽车电子:车载IVI系统的USB、蓝牙接口防护(部分批次符合AEC-Q101车规)。

五、品牌与可靠性优势

扬杰科技作为国内半导体龙头,ESD3V3LB具备:

  • 工艺成熟:先进TVS制造工艺,参数一致性与稳定性可靠;
  • 可靠性测试:通过高低温存储、温度循环、湿度老化等测试,满足工业级/消费级长期使用;
  • 成本效益:国产替代优势明显,性能不逊进口器件,降低采购成本;
  • 技术支持:提供完整datasheet与应用方案,协助客户快速集成。

总结

ESD3V3LB凭借双向防护、3.3V适配、低漏电流、小封装等特点,成为3.3V系统静电与浪涌防护的理想选择,广泛适用于消费电子、可穿戴、IoT等领域,助力设备提升抗干扰能力与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.