WMSIC Electronic Components

GR 74HC245TS

Model74HC245TS
PackageTSSOP-20
BrandGR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GR 74HC245TS
Type
GR
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GR
Electronic Component
74HC245TS
Electronic Component
1
Package
TSSOP-20
Electronic Component
Buffers / Drivers / Transceivers
Electronic Component
74HC
Electronic Component
0.11g
Electronic Component
1
Electronic Component
1
Features
Output
Electronic Component
BM0263546182
Operating Voltage
2V~6V
Output Type
Electronic Component
Type
Electronic Component
Current(IOH)
5.2mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74HC245TS 8位双向三态总线收发器产品概述

一、产品定位与核心功能

74HC245TS是国睿(GR)推出的8位双向三态总线收发器,属于高速CMOS逻辑系列(74HC)器件,专为数字系统中的总线数据双向传输设计。其核心功能是实现8路并行数据的双向收发,通过三态输出避免总线竞争,同时兼容TTL逻辑电平,可灵活适配2V~6V电压域的数字电路,广泛应用于工业控制、通信、消费电子等领域。

二、关键性能参数详解

1. 宽电压适配能力

支持2V~6V直流电源电压,覆盖3.3V、5V等常见数字系统电压,无需额外电平转换电路即可兼容不同电压平台,降低系统设计复杂度。

2. 双向8位通道设计

集成8个独立双向数据通道,可同时传输8位并行数据,满足高速数据总线的传输需求,适合多模块间的并行数据交互。

3. 三态输出防竞争

输出端具备高阻态(三态):当使能端(OE)为高电平时,所有输出呈高阻,避免多器件同时占用总线导致的竞争问题,支持多收发器共享同一总线。

4. 中等驱动能力

灌电流(IOL)和拉电流(IOH)均为5.2mA,在3.3V电源下可驱动多个TTL/CMOS负载,满足中等驱动需求的应用场景(如驱动LED、小功率逻辑门)。

5. 低静态功耗

静态电流(Iq)仅10μA,待机或低频率工作模式下功耗极低,适合电池供电的便携式设备(如平板、智能手环)或低功耗系统设计。

6. 高速响应特性

74HC系列采用高速CMOS工艺,传输延迟时间(tpd)通常在纳秒级(典型值<10ns@5V),满足高速数据传输的时序要求。

三、封装与引脚配置

74HC245TS采用TSSOP-20封装(薄型小外形封装),尺寸紧凑(4.4mm×6.4mm),适合高密度PCB设计,引脚间距0.65mm,支持自动化贴装。关键引脚功能如下:

  • 引脚1(OE):输出使能端(低电平有效,OE=0时允许收发,OE=1时输出高阻);
  • 引脚2(DIR):方向控制端(DIR=1→A→B,DIR=0→B→A);
  • 引脚310:数据总线A端(A0A7,8位并行I/O);
  • 引脚11、20:电源地(GND);
  • 引脚1219:数据总线B端(B0B7,8位并行I/O);
  • 引脚20:电源正(VCC)。

四、典型应用场景

1. 工业控制总线接口

用于PLC、工业机器人等设备的现场总线数据收发,支持多模块共享总线,实现传感器与执行器的双向数据传输(如温度传感器→PLC输入、执行器→PLC输出)。

2. 通信设备数据交互

在路由器、交换机等网络设备中,作为端口扩展或总线收发器,实现不同模块(如CPU与交换芯片)间的8位并行数据双向传输。

3. 消费电子接口扩展

用于智能家电(如冰箱、洗衣机)、便携式设备的外设接口扩展,兼容3.3V/5V系统,降低电平转换成本(如扩展USB转串口的并行数据通道)。

4. 汽车电子低功耗逻辑

因宽电压、低功耗特性,可用于汽车仪表盘、车载通信系统的逻辑控制,满足-40℃~85℃的汽车级温度范围需求。

五、设计与使用注意事项

  1. 电源去耦:VCC与GND间并联100nF陶瓷电容(靠近器件引脚),抑制电源噪声;
  2. 时序配合:方向控制(DIR)与使能(OE)需配合数据总线时序,避免传输中切换方向;
  3. 静电防护:CMOS器件对静电敏感,设计时串联100Ω~1kΩ限流电阻,生产/使用中采取防静电措施;
  4. 负载限制:输出电流不超过5.2mA,避免负载总电流超限;
  5. 极性防护:严禁VCC与GND反接,防止器件永久损坏。

六、品牌与品质保障

国睿(GR)作为国内专业半导体供应商,74HC245TS符合RoHS环保标准(无铅、无镉),批量生产一致性好,经过温度循环、老化测试,满足工业级可靠性要求,适用于对品质有较高要求的领域。

本概述基于国睿74HC245TS的公开参数整理,具体应用需结合详细 datasheet 确认时序与极限参数。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.