WMSIC Electronic Components

GR RS485

ModelRS485
PackageSOP-8
BrandGR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GR RS485
Type
GR
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GR
Electronic Component
RS485
Electronic Component
1
Package
SOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.414g
Electronic Component
256
Electronic Component
1
Features
Tx / Rx
Electronic Component
BM0263546183
Operating Voltage
5V
Receiver
1
Data
2.5Mbps
Communication
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GR(国睿)RS-485/RS-422 收发器(SOP-8)产品概述

一、产品概述

GR 系列 RS-485 收发器为单驱动器/单接收器(1Tx/1Rx)低功耗芯片,适用于 RS-485 与 RS-422 总线通信。器件在单一 5V 电源下工作,设计为半双工通信,驱动器具备高摆率性能,可支持最高 2.5 Mbps 的数据传输速率,并能在多节点总线(最多 256 节点)环境中可靠工作。封装为工业常用的 SOP-8,便于版级兼容与量产。

二、主要技术参数

  • 类型:收发器(1 驱动 / 1 接收)
  • 工作电压:5V 单电源
  • 最大数据速率:2.5 Mbps
  • 总线节点数:最多 256 节点
  • 静态电流:1.2 mA(典型值)
  • 静电保护:±4 kV(接触/空气放电)
  • 通讯模式:半双工
  • 封装:SOP-8
  • 品牌:GR(国睿)

三、功能特点

  • Tx/Rx 启用:提供驱动使能(DE)和接收使能(RE)管脚,支持对发送和接收功能的独立控制,实现灵活的主从调度与多主系统管理。
  • 热关断保护:当器件过热时,内部热关断电路将驱动输出置为高阻态,以防止过度功耗或器件损坏。
  • 过流保护:驱动器具备短路电流限制功能,发生总线短路或冲突时限制电流,降低系统损害风险。
  • 失效保护(Failsafe):接收器输入具有失效保护特性,当差分输入开路或处于同相电位时,接收端能保证输出处于逻辑高电平,避免悬浮引起的误判。
  • 低功耗设计:静态电流低,可在待机或低活动场景减少系统能耗。
  • 抗静电能力:对常见静电冲击具有良好防护,提升现场可靠性。

四、典型应用

  • 工业现场总线、PLC 通信接口
  • 楼宇自动化、安防系统数据传输
  • 数据采集与传感器网络
  • 电力与能源管理系统(如电表、逆变器)
  • POS 与票务终端等需要长线差分通信的场合

五、封装与接口说明

SOP-8 封装提供紧凑尺寸及良好散热特性,封装引脚包含电源、差分 A/B、DE/RE 控制、接收器输出等常规引脚。DE 与 RE 管脚用于驱动/接收切换控制;热关断或过流动作时,驱动器输出将被置为高阻,以便总线恢复或外部保护动作触发处理。

六、设计建议与注意事项

  • 总线终端:长线或高速场合应在两端加 120Ω 终端电阻并适当配置偏置电阻,确保总线稳定。
  • DE/RE 控制:设计时应合理安排 DE/RE 的逻辑控制以避免总线驱动冲突,必要时采用硬件仲裁或延时控制。
  • 电源与去耦:靠近器件放置 0.1 μF 陶瓷去耦电容并尽量缩短走线,提升抗干扰性能。
  • 布线与差分对:差分对应成对走线并保持阻抗一致,避免交叉干扰与不必要的回路面积。
  • 环境适配:在高噪声或高温场合,考虑增加外部 TVS 和良好散热措施,配合器件的热关断与过流保护实现更高可靠性。

本器件以稳健的过流与热保护、失效保护与低功耗特性,适合工业级通信环境,能在复杂总线拓扑中提供可靠的差分数据传输解决方案。

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