WMSIC Electronic Components

GR GR2103

ModelGR2103
PackageSOP-8
BrandGR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GR GR2103
Type
GR
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GR
Electronic Component
GR2103
Electronic Component
1
Package
SOP-8
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
0.07g
Electronic Component
1
Electronic Component
BM0264390954
Operating Temperature
0℃~+60℃
Operating Voltage
10V~20V
Load Type
MOSFET;IGBT
Driver
Electronic Component
Current(IOH)
600uA
Current(IOL)
600uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GR2103 半桥栅极驱动芯片产品概述

一、产品定位与核心功能

GR2103是国睿(GR)推出的2通道半桥栅极驱动芯片,专为中小功率MOSFET和IGBT功率器件设计,可同时驱动半桥拓扑中的上下桥臂,满足电力电子领域高频开关场景的栅极控制需求。芯片集成欠压保护(UVP)功能,能有效提升系统可靠性,广泛适用于电机驱动、开关电源等典型应用。

二、关键性能参数详解

GR2103的核心参数匹配中小功率电力电子系统的设计需求,关键指标如下:

  1. 驱动拓扑与通道数:采用半桥驱动架构,内置2个独立驱动通道,直接对应半桥电路的上下功率管;
  2. 驱动电流能力:灌电流(IOL)和拉电流(IOH)均为600μA,满足常规中小功率MOSFET/IGBT的栅极充电/放电需求;
  3. 开关速度:上升时间(tr)和下降时间(tf)均为10ns,支持kHz级以上高频开关应用;
  4. 工作电压范围:10V~20V宽电压输入,兼容不同电源设计方案;
  5. 工作温度范围:0℃~+60℃,覆盖常规工业环境与消费电子场景;
  6. 保护特性:集成欠压保护(UVP),当输入电压低于阈值时自动关断输出,避免功率器件因驱动不足损坏。

三、封装与引脚配置

GR2103采用SOP-8贴片封装,体积小巧(约5.2mm×6.0mm),适配自动化贴片生产,便于PCB布局优化。引脚布局遵循半桥驱动常规逻辑,典型功能包括:

  • 电源端(VCC、GND):输入10V~20V工作电压;
  • 信号输入端(IN1、IN2):分别控制上下桥臂输出;
  • 驱动输出端(OUT1、OUT2):连接半桥上下功率管栅极;
  • 悬浮端(VS、COM):适配半桥拓扑中上下桥臂的隔离/悬浮需求(具体定义参考官方 datasheet)。

四、典型应用场景

GR2103的性能特点使其适用于以下场景:

  1. 无刷直流电机(BLDC)驱动:3片芯片可组成三相全桥控制,10ns开关速度支持高频换向,提升电机精度;
  2. 中小功率开关电源:如DC-DC变换器、AC-DC适配器的半桥拓扑,宽电压与欠压保护提升电源可靠性;
  3. 小功率逆变器:太阳能微型逆变器、车载充电器的半桥逆变电路,满足高频切换需求;
  4. 伺服/步进电机控制器:配合功率器件实现绕组精准通断,提升电机响应速度。

五、应用设计注意事项

为保证系统可靠性,设计需注意:

  1. 电源滤波:VCC与GND并联10μF电解+0.1μF陶瓷电容,滤除纹波;
  2. 栅极电阻匹配:OUT端串联10Ω~100Ω电阻(依器件电容调整),抑制振荡;
  3. 散热设计:PCB在GND引脚附近铺铜,提升散热能力;
  4. 引脚布局:缩短OUT与功率器件的连接路径,减少寄生电感;
  5. 欠压阈值确认:参考官方UVP阈值(8V~9V),避免误触发保护。

六、总结

GR2103作为高性价比2通道半桥驱动芯片,凭借10ns开关速度、600μA驱动电流、欠压保护及宽电压范围,为中小功率电力电子系统提供可靠栅极控制方案。SOP-8封装的小体积设计,使其在电机驱动、开关电源等领域具有广泛应用潜力,适合快速原型开发与量产。

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