WMSIC Electronic Components

GR LM393

ModelLM393
PackageSOP-8
BrandGR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GR LM393
Type
GR
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GR
Electronic Component
LM393
Electronic Component
1
Package
SOP-8
Electronic Component
Comparator
Electronic Component
0.1g
Power Supply
2V~36V
Electronic Component
1
Electronic Component
BM0264555452
Operating Temperature
0℃~+70℃
Comparator
Electronic Component
Output Type
Electronic Component
Static Current(Iq)
2.5mA
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GR品牌LM393双路电压比较器产品概述

GR品牌LM393是一款通用型双路电压比较器,采用SOP-8贴片封装,具备宽电源范围、低功耗、开漏输出等核心特点,可直接替代传统LM393系列产品,广泛应用于工业控制、消费电子、通信设备等领域的电平检测、过欠压保护等场景。

一、产品核心定位与典型应用场景

GR LM393定位于通用低功耗双路比较器,专为对精度要求适中、需多路信号对比的场景设计,核心应用包括:

  1. 电压监测类:电池电量过欠压保护、电源电压波动检测、工业设备电压阈值判断;
  2. 信号处理类:模拟信号整形(将正弦波、三角波等整形成方波)、窗口比较(判断信号是否在预设区间内);
  3. 电平转换类:兼容不同逻辑电平(如3.3V/5V/12V系统间的信号转换);
  4. 传感器接口类:与温度、压力等传感器配合,判断传感器输出是否超出正常范围。

二、关键电气参数解析

GR LM393的核心参数适配多数通用场景,关键指标及实际意义如下:

  • 双路独立比较:内置2个完全独立的比较单元,可同时处理两路信号的“大于/小于”判断,无需额外扩展电路;
  • 输入精度:输入失调电压(V_{OS}=1mV)、输入失调电流(I_{OS}=5nA),确保10mV以上信号对比的低误差,满足多数工业/消费场景需求;
  • 低负载输入:输入偏置电流(I_B=100nA),对高阻抗输入信号(如传感器输出)的负载效应极小,无需额外缓冲电路;
  • 灵活输出:开漏输出类型,需外接1k10kΩ上拉电阻,可兼容3.3V32V逻辑电平,适配不同系统电压;
  • 低功耗:静态电流(I_Q=600μA),适合电池供电设备(如便携式仪器、智能家居终端);
  • 宽电源范围:
    • 单电源:2V~32V(覆盖常见5V/12V/24V系统);
    • 双电源:±16V(支持正负电平信号对比,如模拟音频信号阈值判断);
  • 温度范围:0℃~+70℃(商业级温度,满足一般室内/工业环境需求)。

三、封装与可靠性设计

GR LM393采用SOP-8贴片封装,具备以下优势:

  • 体积小(引脚间距1.27mm):适合小型化PCB设计,节省板级空间;
  • 贴装兼容性:支持自动贴片机生产,降低焊接成本;
  • 引脚兼容性:与传统LM393引脚定义完全一致,可直接替换,无需修改电路布局。

四、典型应用电路说明

4.1 单电源过压保护电路

电路原理:通过分压电阻(R_1/R_2)设定过压阈值(如12V系统设为13.5V),当输入电压(V_{IN})高于阈值时,比较器输出低电平(开漏拉低),触发MCU或继电器保护;若低于阈值则输出高阻态(上拉电阻拉至高电平)。

4.2 窗口比较电路

用两路比较器分别设置上限阈值(V_H)和下限阈值(V_L):当(V_L<V_{IN}<V_H)时,两路比较器输出均为高阻态,上拉后输出高电平;若超出区间则至少一路输出低电平,实现“信号在窗口内/外”的判断。

五、选型与使用注意事项

  1. 上拉电阻选择:开漏输出必须外接上拉电阻,阻值需根据负载电流和系统电压匹配(如5V系统用10kΩ,12V用2kΩ);
  2. 输入信号限制:输入电压需在电源电压范围内(单电源时(V_{SS}≤V_{IN}≤V_{DD}),双电源时(-V_{EE}≤V_{IN}≤V_{CC})),避免损坏器件;
  3. 精度适配:若需处理mV级信号,可通过外部电位器微调失调电压,但GR LM393的1mV失调已满足多数通用场景;
  4. 替代验证:GR LM393与传统LM393引脚、参数兼容,替换时需确认电源范围和输出上拉电阻是否匹配。

GR LM393以高性价比、宽适配性成为通用比较器的优选方案,可满足多数工业控制、消费电子的信号对比需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.