WMSIC Electronic Components

YXC X5032110592MSB2GI Crystal X5032110592MSB2GI

ModelX5032110592MSB2GI
PackageSMD5032-2P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC X5032110592MSB2GI
Type
SMD5032-2P
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
X5032110592MSB2GI
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.153g
Frequency
11.0592MHz
Electronic Component
1
Electronic Component
BM0227689045
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
20pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X5032110592MSB2GI 产品概述

一、产品简介

X5032110592MSB2GI 是 YXC(扬兴科技)出品的一款无源贴片晶振,基准频率 11.0592MHz,SMD5032-2P 封装(5.0 × 3.2mm,2 引脚)。该器件为基频工作、无源晶体元件,适用于需高精度时钟源的微控制器和通信电路,常用于串口波特率、定时与采样电路等场景。

二、主要特点

  • 标称频率:11.0592 MHz(适合标准 UART 波特率分频使用)
  • 常温频差(25°C):±10 ppm
  • 全温区频率稳定度:±20 ppm(工作温度 -40℃ ~ +85℃)
  • 负载电容:20 pF(标称)
  • 封装:SMD5032-2P(贴片,便于自动化贴装)
  • 产品类型:无源晶振(需外部振荡电路/晶体管或 MCU 内部振荡器匹配)

三、典型应用

  • 单片机(MCU)系统时钟,尤其需精确串口时钟的应用(例如 11.0592MHz 可方便产生标准 UART 波特率)
  • 工业控制、仪表与测量设备
  • 通信设备、数据采集与处理模块
  • 消费类电子、嵌入式系统的时间基准源

四、封装与电气参数(摘要)

  • 封装形式:SMD5032-2P(5.0 × 3.2 mm)
  • 引脚数:2 引脚(无源)
  • 额定负载电容:20 pF(用于计算两侧外接负载电容值)
  • 工作温度范围:-40℃ ~ +85℃
  • 频率公差/稳定度:常温 ±10 ppm,整温区 ±20 ppm

关于外接负载电容的参考计算: CL = (C1 × C2) / (C1 + C2) + Cstray。若取 C1 = C2 = C,则 C ≈ 2 × (CL − Cstray)。典型 PCB 寄生电容(Cstray)为 2–5 pF,代入 CL=20 pF,可得到每侧外接电容大约 30–36 pF,实际值应通过电路板与器件的实测微调确认。

五、使用建议与注意事项

  • 布局:将晶振与 MCU(或振荡器输入)尽量靠近,走线短且对称,避免穿过高频干扰线或大电流回路;两侧接地要良好且对称。
  • 外接元件:根据上文公式选择对称负载电容并考虑 PCB 寄生电容,必要时进行频率校准。
  • 焊接工艺:支持常规 SMT 回流焊,建议按生产线通用回流曲线和厂商建议的热循环限制进行,避免高温长时暴露导致性能退化。
  • 机械应力:贴片晶体对剪切与弯曲敏感,避免在贴装和后续工序中施加过大机械应力。
  • ESD 与湿度防护:存放与装配过程中注意防静电和适当干燥,避免受潮或静电损伤。

六、品质与可靠性

YXC 扬兴科技生产工艺成熟,适配自动化 SMT 生产线,产品通过常规出厂电性能检测。对于量产项目,建议与供应商确认批次频率分布、老化测试数据以及是否可提供定制频差或筛选服务,以满足更严苛的频率精度要求。

如需进一步的封装尺寸图、回流焊曲线、等效电路参数或样品测试数据,可联系供应商获取详细数据手册与测试报告。

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