WMSIC Electronic Components

YXC X50328MQB2GI Crystal Oscillator X50328MQB2GI

ModelX50328MQB2GI
PackageSMD5032-2P
BrandYXC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YXC X50328MQB2GI
Type
SMD5032-2P
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YXC
Electronic Component
X50328MQB2GI
Electronic Component
1
Package
SMD5032-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.142g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0227666213
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
16pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X50328MQB2GI 产品概述

一、产品简介

X50328MQB2GI 为 YXC(扬兴科技)推出的一款无源贴片晶振,封装规格为 SMD5032-2P(约 5.0 × 3.2 mm)。标称频率 8.000 MHz,属于经过工业级温区验证的高稳定性晶体元件,适配 MCU、RTC、通信模块等需要精准时钟源的应用场景。

二、主要性能参数

  • 晶振类型:无源贴片晶振(SMD)
  • 标称频率:8.000 MHz
  • 常温频差(初始容差):±10 ppm
  • 负载电容(CL):16 pF
  • 频率稳定度(含温漂等):±20 ppm
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装型号:SMD5032-2P
  • 品牌:YXC 扬兴科技

三、典型电气与使用建议

  • 晶体为无源器件,需配合有源振荡电路(例如单片机内部 Pierce 振荡结构或外部晶体振荡器电路)使用。
  • 负载电容匹配:推荐在晶体两端外接对称电容。按照 CL ≈ C / 2 + Cstray(Cstray 为布线及引脚寄生电容,典型 2–5 pF)计算,若取 Cstray ≈ 2–5 pF,则每侧电容建议约 22–30 pF,常用值 27 pF。实际设计应基于板上寄生电容与目标频率微调。
  • 驱动条件:遵循所使用振荡器电路与 MCU 的驱动电平与输入阻抗要求,避免过驱动以延长晶体寿命并控制相位噪声。

四、封装与安装建议

  • SMD5032-2P 结构紧凑,采用两端端子贴装。建议按照厂商提供的标准 PCB 推荐焊盘进行布局,以保证机械强度与电气性能。
  • 焊接工艺:建议采用无铅回流焊工艺,遵循 JEDEC/IPC 推荐的温度曲线和峰值温度限制;焊接参数应与整板其它元件的工艺兼容。
  • 防护与存储:避免强烈振动、冲击及潮湿环境。长期存储建议密封防潮包装并在规定期限内使用。

五、典型应用领域

  • 工业控制与嵌入式单片机时钟源
  • 通信设备、无线模块本振参考
  • 实时时钟(RTC)与计时、计数类电路
  • 汽车电子(在符合温度和可靠性要求的设计下)

六、质量与可靠性

X50328MQB2GI 针对工业级温区设计,频率稳定度与耐环境性能良好。产品可按需提供出货检验报告,符合常见电子制造环保要求(如 RoHS)。如需更严格的认证或老化筛选,可与供应方沟通定制测试方案。

七、注意事项与采购信息

  • 选型时确认系统对频差、温漂与负载电容的具体要求,必要时在样品评估阶段做频率漂移与启动时间测试。
  • 采购时请注明型号 X50328MQB2GI、频率 8 MHz、CL=16 pF、封装 SMD5032-2P 以确保配货准确。
  • 如需封装尺寸图、推荐 PCB 封装、回流焊曲线或老化与环境测试数据,可联系 YXC 扬兴科技或其授权分销商获取详细数据手册与样品支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.