WMSIC Electronic Components

YANGJIE BZT52B5V1SQ

ModelBZT52B5V1SQ
PackageSOD-323(SC-90)
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE BZT52B5V1SQ
Type
SOD-323(SC-90)
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
BZT52B5V1SQ
Electronic Component
1
Package
SOD-323(SC-90)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0264933756
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52B5V1SQ 产品概述

一、主要参数概览

BZT52B5V1SQ 是扬杰(YANGJIE)生产的一款小功率稳压二极管,标称稳压值为 5.1V,稳压范围 5.0V ~ 5.2V。关键电气与热参数如下:

  • 标称稳压:5.1V(范围 5.0V ~ 5.2V)
  • 反向电流 Ir:2 μA @ 2.0V
  • 阻抗 Zzt(动态阻抗):60 Ω
  • 最大耗散功率 Pd:300 mW(环境温度条件下)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-323(SC-90),适用于贴片装配

二、器件特点与优势

  • 小封装、低功耗:SOD-323 封装体积小,适合空间受限的移动和便携设备;300 mW 的耗散能力满足低功率基准与钳位场合。
  • 稳定的静态电压:5.1V 标称电压,5.0–5.2V 的公差适合一般数字或模拟电路的基准与保护要求。
  • 低反向泄漏:在 2.0V 条件下 Ir 仅 2 μA,有利于高阻抗回路和低功耗设计。
  • 典型 Zzt 值 60 Ω:在小电流范围内仍能提供基本的稳压性能;设计时需考虑其动态阻抗对负载变化的影响。

三、典型应用场景

  • 低功耗电源的稳压参考与基准电压源
  • 微控制器供电保护与过压钳位
  • I/O 接口与信号线的过压保护
  • 电池供电设备中的局部稳压与电压移位
  • 小信号电路中作为低精度电压参考或夹位器件

四、设计与选型建议

  • 工作电流与限流:稳压二极管需与串联限流电阻配合使用。选阻公式为 R = (Vin - Vz) / Iz(Iz 为期望稳流电流)。示例:若 Vin = 12V、Vz = 5.1V、取 Iz = 5 mA,则 R ≈ 1.38 kΩ;此时二极管耗散 Pd ≈ 5.1V × 5 mA = 25.5 mW,远低于 300 mW 安全范围。
  • 耗散与热管理:Pd 为器件在标准条件下的最大耗散,实际应用需考虑环境温度与PCB散热。SOD-323 散热受限,建议在高环境温或持续高电流工况下降低 Iz 或采用更大功率器件。
  • 动态阻抗影响:Zzt = 60 Ω 意味着在电流变化时输出电压会随之波动。若需更低纹波或更高精度,应减小电流波动或并联更低阻抗的稳压源/参考。
  • 噪声与稳压性能:若稳压输出用于敏感模拟电路,建议在二极管两端并联低 ESR 电容以滤除高频噪声与瞬态。

五、封装与装配注意

  • 极性识别:SOD-323 封装具有极性标识,安装时注意阴极(带环或标记)方向,避免反接。
  • 回流焊兼容性:SMD 工艺装配,遵循厂商回流焊温度曲线,避免长时间高温导致器件老化;敏感于过高的回流峰值温度时应参照详细数据手册。
  • PCB 布局:为改善散热,尽量将二极管放置在较大铜面积或接近散热路径的位置;保证限流电阻与二极管布局合理以降低寄生阻抗。

六、可靠性与测试建议

  • 在样机阶段进行温度应力和长期稳压漂移测试,确认在目标 Iz、环境温度下的电压漂移和热失稳情况。
  • 对于关键产品,建议做浪涌、ESD 与循环温度测试以验证封装和焊接可靠性。
  • 关注结温:器件额定的 Pd 通常在特定环境温度(如 25 ℃)下给出,实际应用要计算结温并保证不超过最大结温 +150 ℃。

七、采购与替代

  • 型号:BZT52B5V1SQ(厂家:YANGJIE 扬杰);常见供货形式为 SMD 卷带(tape & reel)。
  • 替代方案:可在 BZT52 系列或其他厂家的 5.1V 小功率稳压二极管中挑选相近参数(注意 Pd、Zzt 与封装差异),重要的是确认动态阻抗、漏电流与热特性满足应用要求。

如需针对具体电源电压、工作电流和环境温度的定制选型建议或稳压网络计算示例,可提供系统工况参数以便给出更精确的设计指导。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.