WMSIC Electronic Components

GR PCF8574WS16ARAE

ModelPCF8574WS16ARAE
PackageSOP-16-300mil
BrandGR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GR PCF8574WS16ARAE
Type
GR
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GR
Electronic Component
PCF8574WS16ARAE
Electronic Component
1
Package
SOP-16-300mil
Electronic Component
I / O Expander
Electronic Component
1g
Electronic Component
1
I / O
8
Features
Built-in LEDDriver; and
Electronic Component
BM0264390967
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~6V
Interface Type
I2C
Output Type
Output
Current(IOH)
30uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCF8574WS16ARAE 产品概述

一、概述

PCF8574WS16ARAE(品牌:GR/国睿)是一款带中断输出的远程 8 位 I2C 总线 I/O 扩展器,封装为 SOP-16-300mil。器件工作电压范围宽(2.5V~6V),工作温度覆盖工业级(-40℃~+85℃),可在系统中用作开关量输入或准双向口输出,常见于人机接口、指示灯驱动和键盘矩阵等场景。

二、主要特性

  • 接口类型:I2C(标准模式,fc=100kHz)
  • I/O 数量:8 路准双向口
  • 中断输出:带中断(用于外部主机快速响应输入状态变化)
  • 输出类型:准双向口,典型高电平回流电流 IOH≈30µA,低电平下灌电流 IOL≈10mA
  • 支持设备数:通过地址引脚最多级联 8 个设备
  • 功能:内置 LED 驱动能力、级联与地址扩展
  • 工作电压/温度:2.5V~6V;-40℃~+85℃

三、功能说明

PCF8574 的每一路 I/O 为准双向结构,器件上电后各口处于高电平(弱上拉),外部可通过写寄存器置低以驱动负载或通过读操作检测外部输入。中断输出在检测到输入状态变化时向主机发出请求(通常为低电平),实现事件驱动式采样,降低主机轮询负担。由于 IOH 源电流较小,建议以低电平(下拉)驱动 LED 或通过外部上拉/驱动器提升输出能力。

四、接口与地址扩展

器件通过标准 I2C SDA/SCL 接口通信,建议在总线上配合合理的上拉电阻(典型 2.2k~10kΩ,常用 4.7kΩ)与去耦电容(VCC 侧 0.1µF)。器件提供地址引脚用于地址配置,可最多并联 8 个设备实现 8×8 或更大扩展。中断线通常为开漏输出,需外部上拉。

五、典型应用

  • 按键矩阵、拨码开关读取
  • 面板指示灯或背光 LED 的低侧驱动(建议串联限流电阻)
  • 工业控制中的远程 I/O 扩展、楼宇控制面板
  • 嵌入式系统中减少 MCU I/O 占用、实现模块化扩展

六、设计与注意事项

  • 由于准双向口 IOH 源电流受限,外接指示灯建议采用低侧驱动或外部上拉/驱动器;避免直接在高电平压驱动大电流负载。
  • 中断线通常为开漏,需外接上拉电阻并连接到 MCU 可产生中断的管脚。
  • I2C 总线长度与设备数量增加时注意上拉阻值和总线时序完整性,必要时增加总线缓冲或使用更强驱动器。
  • 供电侧加装去耦电容,布线尽量缩短模拟地与信号地回路。

七、封装与订购信息

封装:SOP-16-300mil,适合常规 PCB 插装与波峰/回流焊加工。型号:PCF8574WS16ARAE,品牌:GR(国睿)。如需批量采购或获取详细封装图与原理图参考,请联系供应商索取完整数据手册与应用笔记。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.